Telecom Circuit, 1-Func, PDSO20, MFP-20
Parameter Name | Attribute value |
Maker | TOKO, INC. |
package instruction | SSOP, |
Reach Compliance Code | unknown |
JESD-30 code | R-PDSO-G20 |
length | 10.2 mm |
Number of functions | 1 |
Number of terminals | 20 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | -20 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SSOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, SHRINK PITCH |
Certification status | Not Qualified |
Maximum seat height | 1.8 mm |
Maximum slew rate | 6.5 mA |
Nominal supply voltage | 3 V |
surface mount | YES |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 1 mm |
Terminal location | DUAL |
width | 4.4 mm |
TK10658MCMG | TK10658DCBX | TK10658DCMG | TK10658MCBX | TK10658MCTL | TK10658MCTR | TK10658MCTX | |
---|---|---|---|---|---|---|---|
Description | Telecom Circuit, 1-Func, PDSO20, MFP-20 | Telecom Circuit, 1-Func, PDIP20, PLASTIC, DIP-20 | Telecom Circuit, 1-Func, PDIP20, PLASTIC, DIP-20 | Telecom Circuit, 1-Func, PDSO20, MFP-20 | Telecom Circuit, 1-Func, PDSO20, MFP-20 | Telecom Circuit, 1-Func, PDSO20, MFP-20 | Telecom Circuit, 1-Func, PDSO20, MFP-20 |
Maker | TOKO, INC. | TOKO, INC. | TOKO, INC. | TOKO, INC. | TOKO, INC. | TOKO, INC. | TOKO, INC. |
package instruction | SSOP, | DIP, | DIP, | SSOP, | SSOP, | SSOP, | SSOP, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
length | 10.2 mm | 26.2 mm | 26.2 mm | 10.2 mm | 10.2 mm | 10.2 mm | 10.2 mm |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SSOP | DIP | DIP | SSOP | SSOP | SSOP | SSOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, SHRINK PITCH | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.8 mm | 4.1 mm | 4.1 mm | 1.8 mm | 1.8 mm | 1.8 mm | 1.8 mm |
Maximum slew rate | 6.5 mA | 6.5 mA | 6.5 mA | 6.5 mA | 6.5 mA | 6.5 mA | 6.5 mA |
Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | NO | NO | YES | YES | YES | YES |
Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1 mm | 2.54 mm | 2.54 mm | 1 mm | 1 mm | 1 mm | 1 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 4.4 mm | 7.62 mm | 7.62 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |