TP53130N datasheet, PDF - EEWORLD Datasheet

TP53130N: DescriptionIC TELEPHONE DIALER CKT, PDIP18, PLASTIC, DIP-18, Telephone Circuit; CategoryWireless rf/communication Telecom circuit; File Size305KB，5 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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TP53130N Overview

IC TELEPHONE DIALER CKT, PDIP18, PLASTIC, DIP-18, Telephone Circuit

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP18,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
length	21.755 mm
Number of functions	1
Number of terminals	18
Maximum operating temperature	70 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	2 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	TELEPHONE DIALER CIRCUIT
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

	TP53130N	MM53130N
Description	IC TELEPHONE DIALER CKT, PDIP18, PLASTIC, DIP-18, Telephone Circuit	IC,TELEPHONE DIALER,TONE,CMOS,DIP,18PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
Reach Compliance Code	unknown	compliant
JESD-30 code	R-PDIP-T18	R-PDIP-T18
JESD-609 code	e0	e0
Number of terminals	18	18
Maximum operating temperature	70 °C	70 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP18,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

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