Cache SRAM, 128KX9, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Micron Technology |
Parts packaging code | QFP |
package instruction | PLASTIC, MS-026, TQFP-100 |
Contacts | 100 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 8.5 ns |
I/O type | COMMON |
JESD-30 code | R-PQFP-G100 |
JESD-609 code | e0 |
length | 20 mm |
memory density | 1179648 bit |
Memory IC Type | CACHE SRAM |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 131072 words |
character code | 128000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX9 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LQFP |
Encapsulate equivalent code | QFP100,.63X.87 |
Package shape | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Maximum standby current | 0.01 A |
Minimum standby current | 3.14 V |
Maximum slew rate | 0.25 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | QUAD |
width | 14 mm |
MT58LC32K36B4LG-8.5 | MT58LC32K36B4LG-10 | MT58LC32K36B4LG-9 | MT58LC32K32B4LG-8.5 | MT58LC32K32B4LG-7.5 | MT58LC64K18B4LG-8.5 | MT58LC64K18B4LG-7.5 | MT58LC32K36B4LG-7.5 | |
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Description | Cache SRAM, 128KX9, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX9, 10ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Standard SRAM, 128KX9, 9ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX8, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX8, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 64KX18, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 64KX18, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX9, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
package instruction | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 |
Contacts | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | unknown | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 8.5 ns | 10 ns | 9 ns | 8.5 ns | 7.5 ns | 8.5 ns | 7.5 ns | 7.5 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
memory density | 1179648 bit | 1179648 bit | 1179648 bit | 1048576 bit | 1048576 bit | 1179648 bit | 1179648 bit | 1179648 bit |
Memory IC Type | CACHE SRAM | CACHE SRAM | STANDARD SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
memory width | 9 | 9 | 9 | 8 | 8 | 18 | 18 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 65536 words | 65536 words | 131072 words |
character code | 128000 | 128000 | 128000 | 128000 | 128000 | 64000 | 64000 | 128000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 128KX9 | 128KX9 | 128KX9 | 128KX8 | 128KX8 | 64KX18 | 64KX18 | 128KX9 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
Encapsulate equivalent code | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
Maximum standby current | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
Minimum standby current | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
Maximum slew rate | 0.25 mA | 0.2 mA | 0.25 mA | 0.25 mA | 0.28 mA | 0.25 mA | 0.28 mA | 0.28 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |