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SIHFIBC20G-E3

Description
1.7 A, 600 V, 4.4 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
Categorysemiconductor    Discrete semiconductor   
File Size4MB,7 Pages
ManufacturerKersemi Electronic
Websitehttp://www.kersemi.com
Download Datasheet Parametric Compare View All

SIHFIBC20G-E3 Overview

1.7 A, 600 V, 4.4 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB

SIHFIBC20G-E3 Parametric

Parameter NameAttribute value
Number of terminals3
Minimum breakdown voltage600 V
Processing package descriptionLEAD FREE, TO-220, FULL PACK-3
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRECTANGULAR
Package SizeFLANGE MOUNT
Terminal formTHROUGH-HOLE
terminal coatingMATTE TIN
Terminal locationSINGLE
Packaging MaterialsPLASTIC/EPOXY
structureSINGLE WITH BUILT-IN DIODE
Shell connectionISOLATED
Number of components1
transistor applicationsSWITCHING
Transistor component materialsSILICON
Channel typeN-CHANNEL
field effect transistor technologyMETAL-OXIDE SEMICONDUCTOR
operating modeENHANCEMENT
Transistor typeGENERAL PURPOSE POWER
Maximum leakage current1.7 A
Rated avalanche energy84 mJ
Maximum drain on-resistance4.4 ohm
Maximum leakage current pulse6.8 A

SIHFIBC20G-E3 Related Products

SIHFIBC20G-E3 IRFIBC20G IRFIBC20GPBF SIHFIBC20G
Description 1.7 A, 600 V, 4.4 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB 1.7 A, 600 V, 4.4 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB 1.7 A, 600 V, 4.4 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB 1.7 A, 600 V, 4.4 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
Number of terminals 3 3 3 3
Minimum breakdown voltage 600 V 600 V 600 V 600 V
Processing package description LEAD FREE, TO-220, FULL PACK-3 LEAD FREE, TO-220, FULL PACK-3 LEAD FREE, TO-220, FULL PACK-3 LEAD FREE, TO-220, FULL PACK-3
Lead-free Yes Yes Yes Yes
EU RoHS regulations Yes Yes Yes Yes
state ACTIVE ACTIVE ACTIVE ACTIVE
packaging shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package Size FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT FLANGE MOUNT
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
terminal coating MATTE TIN MATTE TIN MATTE TIN MATTE TIN
Terminal location SINGLE SINGLE SINGLE SINGLE
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
structure SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
Shell connection ISOLATED ISOLATED ISOLATED ISOLATED
Number of components 1 1 1 1
transistor applications SWITCHING SWITCHING SWITCHING SWITCHING
Transistor component materials SILICON SILICON SILICON SILICON
Channel type N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
field effect transistor technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
operating mode ENHANCEMENT ENHANCEMENT ENHANCEMENT ENHANCEMENT
Transistor type GENERAL PURPOSE POWER GENERAL PURPOSE POWER GENERAL PURPOSE POWER GENERAL PURPOSE POWER
Maximum leakage current 1.7 A 1.7 A 1.7 A 1.7 A
Rated avalanche energy 84 mJ 84 mJ 84 mJ 84 mJ
Maximum drain on-resistance 4.4 ohm 4.4 ohm 4.4 ohm 4.4 ohm
Maximum leakage current pulse 6.8 A 6.8 A 6.8 A 6.8 A

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