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V62/04609-02XE

Description
64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,131 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

V62/04609-02XE Overview

64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532

V62/04609-02XE Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeBGA
package instructionHFBGA, BGA532,26X26,32
Contacts532
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width23
barrel shifterNO
bit size32
boundary scanYES
maximum clock frequency75.19 MHz
External data bus width64
FormatFIXED POINT
Integrated cacheYES
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B532
length23 mm
low power modeYES
Number of DMA channels64
Number of external interrupt devices4
Number of terminals532
Number of timers3
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHFBGA
Encapsulate equivalent codeBGA532,26X26,32
Package shapeSQUARE
Package formGRID ARRAY, HEAT SINK/SLUG, FINE PITCH
power supply1.2,3.3 V
Certification statusNot Qualified
RAM (number of words)16384
Maximum seat height3.3 mm
Maximum supply voltage1.31 V
Minimum supply voltage1.19 V
Nominal supply voltage1.25 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width23 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER

V62/04609-02XE Related Products

V62/04609-02XE V62/04609-01XE V62/04609-03XE
Description 64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532 64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532 64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532
Maker Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA BGA BGA
package instruction HFBGA, BGA532,26X26,32 HFBGA, BGA532,26X26,32 HFBGA, BGA532,26X26,32
Contacts 532 532 532
Reach Compliance Code compliant compliant compliant
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 23 23 23
barrel shifter NO NO NO
bit size 32 32 32
boundary scan YES YES YES
maximum clock frequency 75.19 MHz 75.19 MHz 75.19 MHz
External data bus width 64 64 64
Format FIXED POINT FIXED POINT FIXED POINT
Integrated cache YES YES YES
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B532 S-PBGA-B532 S-PBGA-B532
length 23 mm 23 mm 23 mm
low power mode YES YES YES
Number of DMA channels 64 64 64
Number of external interrupt devices 4 4 4
Number of terminals 532 532 532
Number of timers 3 3 3
Maximum operating temperature 105 °C 105 °C 105 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HFBGA HFBGA HFBGA
Encapsulate equivalent code BGA532,26X26,32 BGA532,26X26,32 BGA532,26X26,32
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, HEAT SINK/SLUG, FINE PITCH GRID ARRAY, HEAT SINK/SLUG, FINE PITCH GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
power supply 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (number of words) 16384 16384 16384
Maximum seat height 3.3 mm 3.3 mm 3.3 mm
Maximum supply voltage 1.31 V 1.31 V 1.31 V
Minimum supply voltage 1.19 V 1.19 V 1.19 V
Nominal supply voltage 1.25 V 1.25 V 1.25 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM
width 23 mm 23 mm 23 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
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