|
V62/04609-02XE |
V62/04609-01XE |
V62/04609-03XE |
Description |
64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532 |
64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532 |
64-BIT, 75.19MHz, OTHER DSP, PBGA532, 23 X 23 MM, 0.80 MM PITCH, PLASTIC, BGA-532 |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
BGA |
BGA |
BGA |
package instruction |
HFBGA, BGA532,26X26,32 |
HFBGA, BGA532,26X26,32 |
HFBGA, BGA532,26X26,32 |
Contacts |
532 |
532 |
532 |
Reach Compliance Code |
compliant |
compliant |
compliant |
ECCN code |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
Other features |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
ALSO REQUIRES 3.3V SUPPLY |
Address bus width |
23 |
23 |
23 |
barrel shifter |
NO |
NO |
NO |
bit size |
32 |
32 |
32 |
boundary scan |
YES |
YES |
YES |
maximum clock frequency |
75.19 MHz |
75.19 MHz |
75.19 MHz |
External data bus width |
64 |
64 |
64 |
Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
Integrated cache |
YES |
YES |
YES |
Internal bus architecture |
MULTIPLE |
MULTIPLE |
MULTIPLE |
JESD-30 code |
S-PBGA-B532 |
S-PBGA-B532 |
S-PBGA-B532 |
length |
23 mm |
23 mm |
23 mm |
low power mode |
YES |
YES |
YES |
Number of DMA channels |
64 |
64 |
64 |
Number of external interrupt devices |
4 |
4 |
4 |
Number of terminals |
532 |
532 |
532 |
Number of timers |
3 |
3 |
3 |
Maximum operating temperature |
105 °C |
105 °C |
105 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HFBGA |
HFBGA |
HFBGA |
Encapsulate equivalent code |
BGA532,26X26,32 |
BGA532,26X26,32 |
BGA532,26X26,32 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
power supply |
1.2,3.3 V |
1.2,3.3 V |
1.2,3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
RAM (number of words) |
16384 |
16384 |
16384 |
Maximum seat height |
3.3 mm |
3.3 mm |
3.3 mm |
Maximum supply voltage |
1.31 V |
1.31 V |
1.31 V |
Minimum supply voltage |
1.19 V |
1.19 V |
1.19 V |
Nominal supply voltage |
1.25 V |
1.25 V |
1.25 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
width |
23 mm |
23 mm |
23 mm |
uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |