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MCIMX27LMOP4A |
MCIMX27VJP4A |
MCIMX27VOP4A |
MCIMX27MJP4A |
Description |
32-BIT, 400MHz, MICROPROCESSOR, PBGA473, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473 |
32-BIT, 400MHz, MICROPROCESSOR, PBGA404, 17 X 17 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-404 |
32-BIT, 400MHz, MICROPROCESSOR, PBGA404, 17 X 17 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-404 |
32-BIT, 400MHz, MICROPROCESSOR, PBGA473, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
BGA |
BGA |
BGA |
BGA |
package instruction |
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473 |
17 X 17 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-404 |
17 X 17 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-404 |
19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-473 |
Contacts |
473 |
404 |
404 |
473 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
Other features |
ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US |
ALSO OPERATES 1.3V AT 266MHZ |
ALSO OPERATES 1.3V AT 266MHZ; UNAVAILABLE FOR IMPORT OR SALE IN US |
ALSO OPERATES 1.3V AT 266MHZ |
Address bus width |
26 |
26 |
26 |
26 |
bit size |
32 |
32 |
32 |
32 |
boundary scan |
YES |
YES |
YES |
YES |
maximum clock frequency |
26 MHz |
26 MHz |
26 MHz |
26 MHz |
External data bus width |
16 |
16 |
16 |
16 |
Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
Integrated cache |
YES |
YES |
YES |
YES |
JESD-30 code |
S-PBGA-B473 |
S-PBGA-B404 |
S-PBGA-B404 |
S-PBGA-B473 |
JESD-609 code |
e1 |
e1 |
e1 |
e1 |
length |
19 mm |
17 mm |
17 mm |
19 mm |
low power mode |
YES |
YES |
YES |
YES |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
Number of terminals |
473 |
404 |
404 |
473 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-20 °C |
-20 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFBGA |
LFBGA |
LFBGA |
LFBGA |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
Certification status |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Maximum seat height |
1.54 mm |
1.4 mm |
1.4 mm |
1.54 mm |
speed |
400 MHz |
400 MHz |
400 MHz |
400 MHz |
Maximum supply voltage |
1.52 V |
1.52 V |
1.52 V |
1.52 V |
Minimum supply voltage |
1.38 V |
1.38 V |
1.38 V |
1.38 V |
Nominal supply voltage |
1.45 V |
1.45 V |
1.45 V |
1.45 V |
surface mount |
YES |
YES |
YES |
YES |
Temperature level |
INDUSTRIAL |
OTHER |
OTHER |
INDUSTRIAL |
Terminal surface |
TIN SILVER COPPER |
TIN SILVER COPPER |
TIN SILVER COPPER |
TIN SILVER COPPER |
Terminal form |
BALL |
BALL |
BALL |
BALL |
Terminal pitch |
0.8 mm |
0.65 mm |
0.65 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
width |
19 mm |
17 mm |
17 mm |
19 mm |
uPs/uCs/peripheral integrated circuit type |
MICROPROCESSOR |
MICROPROCESSOR |
MICROPROCESSOR |
MICROPROCESSOR |
Maker |
Rochester Electronics |
- |
Rochester Electronics |
Rochester Electronics |