Flash Module, 256KX8, 170ns, CPGA66, CERAMIC, PGA-66
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | B&B Electronics Manufacturing Company |
Parts packaging code | PGA |
package instruction | PGA, PGA66,11X11 |
Contacts | 66 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 170 ns |
Other features | USER CONFIGURABLE AS 64K X 32 |
Spare memory width | 16 |
Data polling | NO |
JESD-30 code | S-CPGA-P66 |
JESD-609 code | e0 |
memory density | 2097152 bit |
Memory IC Type | FLASH MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 66 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Encapsulate equivalent code | PGA66,11X11 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 7.62 mm |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
switch bit | NO |
type | NOR TYPE |