Flash, 2MX8, PDSO8, ROHS COMPLIANT, PACKAGE
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Micron Technology |
| Parts packaging code | SOIC |
| package instruction | HVSON, SOLCC8,.25 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 25 MHz |
| Data retention time - minimum | 20 |
| Durability | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-N8 |
| JESD-609 code | e3 |
| length | 6 mm |
| memory density | 16777216 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVSON |
| Encapsulate equivalent code | SOLCC8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3/3.3 V |
| Programming voltage | 2.7 V |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Serial bus type | SPI |
| Maximum standby current | 0.00001 A |
| Maximum slew rate | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| type | NOR TYPE |
| width | 5 mm |
| Maximum write cycle time (tWC) | 15 ms |
| write protect | HARDWARE/SOFTWARE |
| M25P16-VMP6TG | M25P16-VME6TG | M25P16-VMN3TPB | M25P16-VMF6TP | M25P16-VMN6TP | M25P16-VMN6TPBA | M25P16-VMF3TPB | M25P16-VMW6TG | M25P16-VMC6TG | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Flash, 2MX8, PDSO8, ROHS COMPLIANT, PACKAGE | Flash, 2MX8, PDSO8, 8 X 6 MM, ROHS COMPLIANT, VDFPN-8 | Flash, 2MX8, PDSO8, ROHS COMPLIANT, PACKAGE | Flash, 2MX8, PDSO16, ROHS COMPLIANT, PACKAGE | Flash, 2MX8, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 | Flash, 2MX8, PDSO8, 0.150 INCH, ROHS COMPLIANT, SOP-8 | Flash, 2MX8, PDSO16, SOP-16 | Flash, 2MX8, PDSO8, SOP-8 | Flash, 2MX8, PDSO8, 4 X 3 MM, ROHS COMPLIANT, UFDFPN-8 |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| package instruction | HVSON, SOLCC8,.25 | HVSON, SOLCC8,.3 | SOP, SOP8,.25 | SOP, SOP16,.4 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP16,.4 | SOP, SOP8,.3 | VSON, SOLCC8,.12,32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Maximum clock frequency (fCLK) | 25 MHz | 25 MHz | 75 MHz | 25 MHz | 25 MHz | 75 MHz | 75 MHz | 25 MHz | 75 MHz |
| Data retention time - minimum | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-G16 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G16 | R-PDSO-G8 | R-PDSO-N8 |
| length | 6 mm | 8 mm | 4.9 mm | 10.3 mm | 4.9 mm | 4.9 mm | 10.3 mm | 5.62 mm | 4 mm |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 16 | 8 | 8 | 16 | 8 | 8 |
| word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVSON | HVSON | SOP | SOP | SOP | SOP | SOP | SOP | VSON |
| Encapsulate equivalent code | SOLCC8,.25 | SOLCC8,.3 | SOP8,.25 | SOP16,.4 | SOP8,.25 | SOP8,.25 | SOP16,.4 | SOP8,.3 | SOLCC8,.12,32 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| power supply | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| Programming voltage | 2.7 V | 2.7 V | 3 V | 2.7 V | 2.7 V | 2.7 V | 3 V | 2.7 V | 2.7 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1 mm | 1 mm | 1.75 mm | 2.65 mm | 1.75 mm | 1.75 mm | 2.3 mm | 2.5 mm | 0.6 mm |
| Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| Maximum standby current | 0.00001 A | 0.00001 A | 0.0001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.0001 A | 0.00001 A | 0.00001 A |
| Maximum slew rate | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
| Terminal form | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED |
| type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 5 mm | 6 mm | 3.9 mm | 7.5 mm | 3.9 mm | 3.9 mm | 7.5 mm | 5.62 mm | 3 mm |
| write protect | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free | - | Lead free | - |
| Parts packaging code | SOIC | DFP | SOIC | SOIC | SOIC | - | - | SOIC | - |
| Contacts | 8 | 8 | 8 | 16 | 8 | - | - | 8 | - |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | - |
| Maximum write cycle time (tWC) | 15 ms | 15 ms | - | 15 ms | 15 ms | - | - | 15 ms | - |
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