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ESQT-107-02-F-Q-375

Description
Board Stacking Connector
CategoryThe connector    The connector   
File Size403KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric View All

ESQT-107-02-F-Q-375 Overview

Board Stacking Connector

ESQT-107-02-F-Q-375 Parametric

Parameter NameAttribute value
MakerSAMTEC
Reach Compliance Codecompliant
Connector typeBOARD STACKING CONNECTOR
F-217
ESQT–125–02–L–Q–465
ESQT–125–03–M–Q–310
ESQT–115–02–GF–D–600
(2.00 mm) .0787"
ESQT SERIES
FLEXIBLE ELEVATED SOCKET STRIPS
SPECIFICATIONS
For complete specifications
see www.samtec.com?ESQT
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating (ESQT/TMMH):
4.5 A per pin
(1 pin powered per row)
Operating Temp Range:
-55 °C to +125 °C
Contact Resistance:
10 mW
Insertion Depth:
(2.62 mm) .103" to
(5.03 mm) .198" with
(0.38 mm) .015" wipe
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Yes
Lead–Free Solderable:
Yes, for -S, -D & -Q
(Wave only for -T, -5 & -6)
Board Mates:
TMMH, TMM,
MTMM, MMT, TW,
LTMM, ZLTMM, ESQT,
PTT, TSH, TMMS
Cable Mates:
TCMD
High-retention
contacts
APPLICATION
SPECIFIC OPTION:
NOTEBOOK 2.5" DISK
DRIVE INTERFACE
(2.00 mm)
.0787" pitch
Call for part number.
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
ESQT
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
ROW
OPTION
BODY
HEIGHT
OTHER
OPTION
FILE NO. E111594
FILE NO: 090871_0_000
02 thru 50
= Gold flash on contact,
Matte Tin on tail
–F
= Single
Row
–S
–“XXX”
= Body
Height
(in inches)
–“XXX”
= Polarized
Position
(Indicate
position
number)
Note:
This Series is
non-standard, non-returnable.
Other Solutions
Surface
Mount
Low
Profile
See SQW and
TLE Series.
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–L
= Double
Row
–D
–T
(7.87 mm)
.310"
minimum for
–S, –D, –Q
(9.53 mm)
.375"
minimum for
–T, –5, –6
300
No. of positions x
(2.00) .0787 + (0.30) .012
06
= 20 µ" (0.51 µm)
Gold on contact,
Matte Tin on tail
–M
= Triple
Row
= Quad
Row
–Q
–5
–6
See CLT Series.
High
Reliability
Right-
Angle
(2.00) No. of
.0787 rows
TYP
x
(2.00)
.0787
295
01
See SMM Series.
= 15 µ" (0.38 µm)
Gold on contact,
Gold flash on tail
(Recommended for
self-nesting)
(–02 lead style only)
–GF
OTHER SOLUTIONS
= Five
Row
= Six
Row
Paste In Hole (PIH) processing.
Contact Samtec ASP Group.
(Not recommended for stack through
applications)
LEAD
STYLE
MAX MAX BODY
TAIL
HEIGHT
(21.59) (13.72)
(20.32)
– 02
.850 .540
.800
(11.63) (3.76)
(10.36)
–03
.458 .148
.408
(6.35)
.250
(1.52)
.060
A
BODY
HEIGHT
TAIL
(1.27)
.050
MIN
See SQW Series.
PC/104-Plus
TM
Sockets
See ESQT-368
and PTHF Series.
A
(0.50) .020 SQ
(2.00) .0787
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.

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