OTP ROM, 512KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32
Parameter Name | Attribute value |
Maker | Fairchild |
Parts packaging code | QFJ |
package instruction | QCCJ, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 120 ns |
JESD-30 code | R-PQCC-J32 |
length | 13.995 mm |
memory density | 4194304 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 3.56 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
width | 11.455 mm |
NM27C040V120X | NM27C040VE120X | NM27C040VE150X | NM27C040V150X | NM27C040V100X | |
---|---|---|---|---|---|
Description | OTP ROM, 512KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 512KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 512KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 512KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 512KX8, 100ns, CMOS, PQCC32, PLASTIC, LCC-32 |
Parts packaging code | QFJ | QFJ | QFJ | QFJ | QFJ |
package instruction | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, |
Contacts | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 120 ns | 120 ns | 150 ns | 150 ns | 100 ns |
JESD-30 code | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
length | 13.995 mm | 13.995 mm | 13.995 mm | 13.995 mm | 13.995 mm |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
memory width | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 | 32 |
word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.56 mm | 3.56 mm | 3.56 mm | 3.56 mm | 3.56 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Terminal form | J BEND | J BEND | J BEND | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
width | 11.455 mm | 11.455 mm | 11.455 mm | 11.455 mm | 11.455 mm |
Maker | Fairchild | - | Fairchild | Fairchild | Fairchild |