128 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Microchip |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 2 MHz |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e3 |
| length | 9.46 mm |
| memory density | 2048 bit |
| Memory IC Type | EEPROM |
| memory width | 16 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 128 words |
| character code | 128 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128X16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.32 mm |
| Serial bus type | MICROWIRE |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Maximum write cycle time (tWC) | 6 ms |
| 93LC56BT/P | 93LC66A-I/SM | 93LC56BT-I/SM | 93LC56BT/SM | 93LC66AT-I/SM | |
|---|---|---|---|---|---|
| Description | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8 | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8 | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8 | 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.208 INCH, PLASTIC, SOIC-8 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to |
| Maker | Microchip | Microchip | Microchip | Microchip | Microchip |
| Parts packaging code | DIP | SOIC | SOIC | SOIC | SOIC |
| package instruction | DIP, | SOP, SOP8,.3 | SOP, SOP8,.3 | SOP, SOP8,.3 | SOP, SOP8,.3 |
| Contacts | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| JESD-30 code | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 |
| length | 9.46 mm | 5.28 mm | 5.28 mm | 5.28 mm | 5.28 mm |
| memory density | 2048 bit | 4096 bit | 2048 bit | 2048 bit | 4096 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 16 | 8 | 16 | 16 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 |
| word count | 128 words | 512 words | 128 words | 128 words | 512 words |
| character code | 128 | 512 | 128 | 128 | 512 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | - | -40 °C |
| organize | 128X16 | 512X8 | 128X16 | 128X16 | 512X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 260 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.32 mm | 2.03 mm | 2.03 mm | 2.03 mm | 2.03 mm |
| Serial bus type | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| surface mount | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 40 | 40 | 40 | 40 |
| width | 7.62 mm | 5.2 mm | 5.2 mm | 5.2 mm | 5.2 mm |
| Maximum write cycle time (tWC) | 6 ms | 6 ms | 6 ms | 6 ms | 6 ms |
| Other features | - | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
| Data retention time - minimum | - | 200 | 200 | 200 | 10 |
| Durability | - | 1000000 Write/Erase Cycles | 10000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| Encapsulate equivalent code | - | SOP8,.3 | SOP8,.3 | SOP8,.3 | SOP8,.3 |
| power supply | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| Maximum standby current | - | 0.000001 A | 0.00003 A | 0.000001 A | 0.00003 A |
| Maximum slew rate | - | 0.0015 mA | 0.003 mA | 0.0015 mA | 0.003 mA |
| Nominal supply voltage (Vsup) | - | 3 V | 3 V | 3 V | 3 V |
| write protect | - | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
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