X24022DM datasheet, PDF - EEWORLD Datasheet

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X24022DM: DescriptionEEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8; Categorystorage storage; File Size624KB，11 Pages; ManufacturerXicor Inc.

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X24022DM Overview

EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8

X24022DM Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Xicor Inc.
package instruction	HERMETIC SEALED, CERDIP-8
Reach Compliance Code	unknown
Other features	2 WIRE INTERFACE;PAGE WRITE
Maximum clock frequency (fCLK)	0.1 MHz
Data retention time - minimum	100
Durability	100000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-GDIP-T8
JESD-609 code	e0
memory density	2048 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	256X8
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Serial bus type	I2C
Maximum standby current	0.00005 A
Maximum slew rate	0.002 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	10 ms

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	X24022DM	X24022DMB-3	X24022DMB	X24022DM-3	X24022DM-2.7	X24022DI-2.7	X24022DI-3	X24022DI
Description	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8	EEPROM, 256X8, Serial, CMOS, CDIP8, HERMETIC SEALED, CERDIP-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.	Xicor Inc.
package instruction	HERMETIC SEALED, CERDIP-8	HERMETIC SEALED, CERDIP-8	HERMETIC SEALED, CERDIP-8	HERMETIC SEALED, CERDIP-8	HERMETIC SEALED, CERDIP-8	HERMETIC SEALED, CERDIP-8	HERMETIC SEALED, CERDIP-8	HERMETIC SEALED, CERDIP-8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	2 WIRE INTERFACE;PAGE WRITE	2 WIRE INTERFACE;PAGE WRITE	2 WIRE INTERFACE;PAGE WRITE	2 WIRE INTERFACE;PAGE WRITE	2 WIRE INTERFACE;PAGE WRITE	2 WIRE INTERFACE;PAGE WRITE	2 WIRE INTERFACE;PAGE WRITE	2 WIRE INTERFACE;PAGE WRITE
Maximum clock frequency (fCLK)	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz
Data retention time - minimum	100	100	100	100	100	100	100	100
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
I2C control byte	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 code	R-GDIP-T8	R-GDIP-T8	R-GDIP-T8	R-GDIP-T8	R-GDIP-T8	R-GDIP-T8	R-GDIP-T8	R-GDIP-T8
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
memory density	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8	8
word count	256 words	256 words	256 words	256 words	256 words	256 words	256 words	256 words
character code	256	256	256	256	256	256	256	256
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C
organize	256X8	256X8	256X8	256X8	256X8	256X8	256X8	256X8
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3	DIP8,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	3.3/5 V	5 V	3.3/5 V	3/5 V	3/5 V	3.3/5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	3 V	4.5 V	3 V	2.7 V	2.7 V	3 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Maximum write cycle time (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms

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