EEPROM, 8KX8, 150ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Catalyst |
Parts packaging code | QFJ |
package instruction | QCCJ, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 150 ns |
JESD-30 code | R-PQCC-J32 |
JESD-609 code | e3 |
length | 13.97 mm |
memory density | 65536 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.55 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
width | 11.43 mm |