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WDBR2-150RKTW

Description
Fixed Resistor, Metal Glaze/thick Film, 150ohm, 10% +/-Tol, 600ppm/Cel, Chassis Mount, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size486KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
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WDBR2-150RKTW Overview

Fixed Resistor, Metal Glaze/thick Film, 150ohm, 10% +/-Tol, 600ppm/Cel, Chassis Mount, ROHS COMPLIANT

WDBR2-150RKTW Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerTT Electronics plc
package instructionQuick Connect,
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresFLAME PROOF
JESD-609 codee2
Installation featuresCHASSIS MOUNT
Number of terminals2
Maximum operating temperature200 °C
Minimum operating temperature-55 °C
Package length61 mm
Package shapeRECTANGULAR PACKAGE
Package formQuick Connect
Package width40.6 mm
method of packingBulk
Rated power dissipation(P)200 W
Rated temperature160 °C
resistance150 Ω
Resistor typeFIXED RESISTOR
surface mountNO
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient500 ppm/°C
Terminal surfaceTin/Silver (Sn96Ag4)
Terminal shapePUSH-ON CONNECTOR
Tolerance10%
Ultra Low Profile
Power Resistors
WDBR Series
·
·
·
·
·
·
·
·
Ultra low profile thick-film on steel
500W to 7kW peak power
Single fixing heatsink mountable
Ideal for dynamic braking, inrush limit and
snubber circuits
Choice of flying lead, push-on or solder terminations
Low inductance design
High isolation, even after failsafe overload fusing
RoHS compliant, non-flammable construction
Electrical Data
WDBR1/2
Resistance range
Resistance tolerance
Pulse power rating
1
Power rating on heatsink
TCR
Maximum element temperature
Ambient temperature range (heatsink)
Dielectric withstand
4
Inductance (typical)
2
WDBR1
WDBR2
WDBR3
WDBR5
WDBR7
ohms
%
kW
W
W
ppm/°C
°C
°C
μH
V (dc/ac peak)
12, 15, 20, 22, 25,
47, 50, 100
0.5
160
300
1.5
180
700
12, 15, 20, 22, 25, 47, 50, 100, 150
10
2.0
200
780
+500 to +600
365
-55 to +200
2500
<3
<4
<5
<6
3.5
260
900
5.0
270
1000
7.0
280
1490
Power rating on fan-cooled heatsink
3
Notes:
1. For details of pulse condition see Fig. 1 in Performance Data.
2. Mounted on a 0.53°C/W heatsink with no forced air cooling, air temperature 25°C.
3. Mounted on a 0.53°C/W heatsink with 5m/s forced air cooling, air temperature 25°C.
4. Based on 100% production test, duration 2s minimum
Physical Data
Dimensions in mm, weight without terminations in g
L ±0.1 W ±0.1 t ±0.1 ØD nom a nom b nom c nom Wt. nom
WDBR1/2
WDBR1
WDBR2
WDBR3
WDBR5
WDBR7
31.9
49.3
61
101.6
122
152.4
28.1
35.9
40.6
70
70
101.6
1.5
0.9
5.3
2.2
3.2
7.5
3.2
4.7
13.5
14.0
15.0
3.1
11.2
13.0
22.0
23.8
51.3
4.3
6.2
5.8
10.2
7.4
9.2
6.5
12.6
17.1
50.8
60.7
181.8
L
Substrate thickness = t
W
D
c
a
b
Fixing hole is located centrally except on WDBR1/2 where the dimension from
the edge by the terminations to the mounting hole centre is 16.68mm
Construction
A high integrity dielectric layer is applied to a machined
stainless steel substrate. Thick-film conductor and resistor
patterns are printed and fired, then protected with a high
temperature overglaze. The termination pads are tinned with
solder and optional terminals or leads are soldered on.
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
01.13

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