EEPROM Module, 128KX32, 300ns, Parallel, CMOS, CPGA66, CERAMIC, HIP-66
Parameter Name | Attribute value |
Maker | White Microelectronics |
package instruction | CERAMIC, HIP-66 |
Reach Compliance Code | unknown |
Maximum access time | 300 ns |
Other features | USER CONFIGURABLE AS 512K X 8 |
Spare memory width | 16 |
JESD-30 code | S-CPGA-P66 |
memory density | 4194304 bit |
Memory IC Type | EEPROM MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 66 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX32 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | PIN/PEG |
Terminal location | PERPENDICULAR |
Maximum write cycle time (tWC) | 10 ms |