F6501AVGK datasheet, PDF - EEWORLD Datasheet

F6501AVGK: DescriptionFCCSP-62, Tray; CategoryWireless rf/communication Telecom circuit; File Size471KB，3 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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FCCSP-62, Tray

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	FCCSP
package instruction	BGA-62
Contacts	62
Manufacturer packaging code	AVG62
Reach Compliance Code	compliant
JESD-30 code	R-PBGA-B62
JESD-609 code	e3
Humidity sensitivity level	3
Number of functions	1
Number of terminals	62
Maximum operating temperature	95 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
surface mount	YES
technology	BICMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin (Sn)
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED

	F6501AVGK	F6501AVGK8
Description	FCCSP-62, Tray	FCCSP-62, Reel
Brand Name	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	FCCSP	FCCSP
package instruction	BGA-62	BGA-62
Contacts	62	62
Manufacturer packaging code	AVG62	AVG62
Reach Compliance Code	compliant	compliant
JESD-30 code	R-PBGA-B62	R-PBGA-B62
JESD-609 code	e3	e3
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	62	62
Maximum operating temperature	95 °C	95 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260
surface mount	YES	YES
technology	BICMOS	BICMOS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin (Sn)	Tin (Sn)
Terminal form	BALL	BALL
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED

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