EEPROM, 512X1, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
Parts packaging code | SOIC |
package instruction | TSSOP, TSSOP8,.25 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Other features | DATA RETENTION > 40 YEARS |
Maximum clock frequency (fCLK) | 0.4 MHz |
Data retention time - minimum | 40 |
Durability | 1000000 Write/Erase Cycles |
I2C control byte | 1010XXXR |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e0 |
length | 4.4 mm |
memory density | 512 bit |
Memory IC Type | EEPROM |
memory width | 1 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 512 words |
character code | 512 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512X1 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/5 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Serial bus type | I2C |
Maximum standby current | 0.000001 A |
Maximum slew rate | 0.001 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3 mm |
Maximum write cycle time (tWC) | 15 ms |