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IXTP3N50D2

Description
Power Field-Effect Transistor, 1.5ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, PLASTIC PACKAGE-3
CategoryDiscrete semiconductor    The transistor   
File Size155KB,5 Pages
ManufacturerIXYS
Environmental Compliance
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IXTP3N50D2 Overview

Power Field-Effect Transistor, 1.5ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, PLASTIC PACKAGE-3

IXTP3N50D2 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIXYS
Parts packaging codeTO-220AB
package instructionPLASTIC PACKAGE-3
Contacts3
Reach Compliance Codecompliant
Other featuresUL RECOGNIZED
Shell connectionDRAIN
ConfigurationSINGLE WITH BUILT-IN DIODE
Maximum drain-source on-resistance1.5 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JEDEC-95 codeTO-220AB
JESD-30 codeR-PSFM-T3
Number of components1
Number of terminals3
Operating modeDEPLETION MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)125 W
Certification statusNot Qualified
surface mountNO
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsAMPLIFIER
Transistor component materialsSILICON

IXTP3N50D2 Preview

Depletion Mode
MOSFET
IXTA3N50D2
IXTP3N50D2
D
V
DSX
I
D(on)
R
DS(on)
=
>
500V
3A
1.5
N-Channel
G
S
TO-263 AA (IXTA)
G
S
D (Tab)
Symbol
V
DSX
V
GSX
V
GSM
P
D
T
J
T
JM
T
stg
T
L
T
SOLD
M
d
Weight
Test Conditions
T
J
= 25C to 150C
Continuous
Transient
T
C
= 25C
Maximum Ratings
500
20
30
125
- 55 ... +150
150
- 55 ... +150
V
V
V
W
C
C
C
°C
°C
Nm/lb.in
g
g
TO-220AB (IXTP)
G
DS
D (Tab)
Maximum Lead Temperature for Soldering
1.6 mm (0.062in.) from Case for 10s
Mounting Torque (TO-220)
TO-263
TO-220
300
260
1.13 / 10
2.5
3.0
G = Gate
S = Source
D
= Drain
Tab = Drain
Features
• Normally ON Mode
• International Standard Packages
• Molding Epoxies Meet UL 94 V-0
Flammability Classification
Advantages
Symbol
Test Conditions
(T
J
= 25C, Unless Otherwise Specified)
BV
DSX
V
GS(off)
I
GSX
I
DSX(off)
R
DS(on)
I
D(on)
V
GS
= - 5V, I
D
= 250A
V
DS
= 25V, I
D
= 250A
V
GS
=
20V,
V
DS
= 0V
V
DS
= V
DSX
, V
GS
= - 5V
V
GS
= 0V, I
D
= 1.5A, Note 1
V
GS
= 0V, V
DS
= 25V, Note 1
T
J
= 125C
Characteristic Values
Min.
Typ.
Max.
500
- 2.0
- 4.5
V
V
• Easy to Mount
• Space Savings
• High Power Density
Applications
Audio Amplifiers
Start-up Circuits
Protection Circuits
Ramp Generators
Current Regulators
Active Loads
100
nA
5
A
50
A
1.5
3
A
© 2017 IXYS CORPORATION, All Rights Reserved
DS100148D(4/17)
IXTA3N50D2
IXTP3N50D2
Symbol
Test Conditions
(T
J
= 25C, Unless Otherwise Specified)
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g(on)
Q
gs
Q
gd
R
thJC
R
thCS
TO-220
0.50
V
GS
= 5V, V
DS
= 250V, I
D
= 1.5A
Resistive Switching Times
V
GS
=
5V, V
DS
= 250V, I
D
= 1.5A
R
G
= 3.3 (External)
V
GS
= -10V, V
DS
= 25V, f = 1MHz
V
DS
= 30V, I
D
= 1.5A, Note 1
Characteristic Values
Min.
Typ.
Max.
1.3
2.1
1070
102
24
27
71
56
42
40
5
20
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
1.00
C/W
C/W
Dim.
A
b
b2
c
c2
D
D1
E
E1
e
L
L1
L2
L3
L4
Millimeter
Min.
Max.
4.06
0.51
1.14
0.40
1.14
8.64
8.00
9.65
6.22
2.54
14.61
2.29
1.02
1.27
0
4.83
0.99
1.40
0.74
1.40
9.65
8.89
10.41
8.13
BSC
15.88
2.79
1.40
1.78
0.13
Inches
Min. Max.
.160
.020
.045
.016
.045
.340
.280
.380
.270
.100
.575
.090
.040
.050
0
.190
.039
.055
.029
.055
.380
.320
.405
.320
BSC
.625
.110
.055
.070
.005
1.
2.
3.
4.
Gate
Drain
Source
Drain
Bottom
Side
TO-263 (IXTA) Outline
Safe-Operating-Area Specification
Symbol
SOA
Test Conditions
V
DS
= 400V, I
D
= 0.19A, T
C
= 75C, Tp = 5s
Characteristic Values
Min.
Typ.
Max.
75
W
TO-220 (IXTP) Outline
Source-Drain Diode
Symbol
Test Conditions
(T
J
= 25C, Unless Otherwise Specified)
V
SD
t
rr
I
RM
Q
RM
I
F
= 3A, V
GS
= -10V, Note 1
I
F
= 3A, -di/dt = 100A/s
V
R
= 100V, V
GS
= -10V
Characteristic Values
Min.
Typ.
Max.
0.8
340
10.9
1.86
1.3
V
ns
A
μC
Pins:
1 - Gate
3 - Source
2 - Drain
Note 1. Pulse test, t
300s, duty cycle, d
2%.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXTA3N50D2
IXTP3N50D2
Fig. 1. Output Characteristics @ T
J
= 25 C
3.0
V
GS
= 5V
3V
2V
1V
16
14
12
2V
0V
1.5
V
GS
= 5V
3V
o
Fig. 2. Extended Output Characteristics @ T
J
= 25 C
o
2.5
I
D
- Amperes
2.0
I
D
- Amperes
10
8
6
4
1V
1.0
-1V
0V
0.5
- 2V
- 3V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
2
0
0
5
10
15
20
-1V
- 2V
25
30
0.0
V
DS
- Volts
V
DS
- Volts
Fig. 3. Output Characteristics @ T
J
= 125 C
3.0
V
GS
= 5V
2V
1V
0V
2.0
1.E+00
o
Fig. 4. Drain Current @ T
J
= 25 C
V
GS
= - 2.50V
o
2.5
1.E-01
- 2.75V
- 3.00V
I
D
- Amperes
1.5
-1V
I
D
- Amperes
1.E-02
- 3.25V
- 3.50V
- 3.75V
1.E-03
1.0
- 2V
0.5
- 3V
0.0
0
1
2
3
4
5
6
7
1.E-04
1.E-05
- 4.00V
1.E-06
0
100
200
300
400
500
600
V
DS
- Volts
V
DS
- Volts
Fig. 5. Drain Current @ T
J
= 100 C
1.E+00
1.E+08
o
Fig. 6. Dynamic Resistance vs. Gate Voltage
V
DS
= 350V - 100V
1.E+07
V
GS
= - 2.75V
1.E-01
- 3.00V
I
D
- Amperes
1.E-02
- 3.50V
R
O
- Ohms
- 3.25V
1.E+06
1.E+05
T
J
= 25 C
T
J
= 100 C
o
o
- 3.75V
1.E-03
1.E+04
- 4.00V
1.E-04
1.E+03
0
100
200
300
400
500
600
-4.2
-4.0
-3.8
-3.6
-3.4
-3.2
-3.0
-2.8
-2.6
-2.4
V
DS
- Volts
V
GS
- Volts
© 2017 IXYS CORPORATION, All Rights Reserved
IXTA3N50D2
IXTP3N50D2
Fig. 7. Normalized R
DS(on)
vs. Junction Temperature
2.4
V
GS
= 0V
2.0
I
D
= 1.5A
2.6
3.0
Fig. 8. R
DS(on)
Normalized to I
D
= 1.5A Value
vs. Drain Current
V
GS
= 0V
5V
T
J
= 125 C
o
R
DS(on)
- Normalized
R
DS(on)
- Normalized
2.2
1.6
1.8
1.2
1.4
T
J
= 25 C
o
0.8
1.0
0.4
-50
-25
0
25
50
75
100
125
150
0.6
0
1
2
3
4
5
6
7
8
9
10
T
J
- Degrees Centigrade
I
D
- Amperes
Fig. 9. Input Admittance
10
9
8
7
6
5
4
3
2
1
0
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
0
0
1
2
T
J
= 125 C
25 C
o
- 40 C
o
o
Fig. 10. Transconductance
6
V
DS
= 30V
5
25 C
o
o
V
DS
= 30V
T
J
= - 40 C
o
g
f s
- Siemens
4
125 C
I
D
- Amperes
3
2
1
3
4
5
6
7
8
9
10
V
GS
- Volts
I
D
- Amperes
1.4
Fig. 11. Breakdown and Threshold Voltages
vs. Junction Temperature
10
9
V
GS
= -10V
Fig. 12. Forward Voltage Drop of
Intrinsic Diode
1.3
8
7
BV / V
GS(off)
- Normalized
1.2
I
S
- Amperes
V
GS(off)
@ V
DS
= 25V
6
5
4
3
2
1
T
J
= 25 C
o
1.1
BV
DSX
@ V
GS
= - 5V
1.0
T
J
= 125 C
o
0.9
0.8
-50
-25
0
25
50
75
100
125
150
0
0.4
0.5
0.6
0.7
0.8
0.9
T
J
- Degrees Centigrade
V
SD
- Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTA3N50D2
IXTP3N50D2
Fig. 13. Capacitance
10,000
5
4
3
V
DS
= 250V
I
D
= 1.5A
I
G
= 10mA
Fig. 14. Gate Charge
f
= 1 MHz
Capacitance - PicoFarads
Ciss
1,000
2
V
GS
- Volts
1
0
-1
-2
-3
Coss
100
Crss
10
0
5
10
15
20
25
30
35
40
-4
-5
0
5
10
15
20
25
30
35
40
V
DS
- Volts
Q
G
- NanoCoulombs
Fig. 15. Forward-Bias Safe Operating Area
100
Fig. 16. Forward-Bias Safe Operating Area
@ T
C
= 75 C
100
o
@ T
C
= 25 C
o
R
DS(on)
Limit
10
10
R
DS(on)
Limit
I
D
- Amperes
I
D
- Amperes
25μs
100μs
25μs
100μs
1
o
1
T
J
= 150 C
T
C
= 25 C
Single Pulse
0.1
o
o
1ms
10ms
100ms
DC
1ms
T
J
= 150 C
T
C
= 75 C
Single Pulse
o
10ms
100ms
DC
100
1,000
0.1
Fig. 17. Maximum Transient Thermal Impedance
100
1,000
10
10.00
10
V
DS
- Volts
V
DS
- Volts
Fig. 17. Maximum Transient Thermal Impedance
2.00
1.00
Z
(th)JC
- k / W
0.10
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
© 2017 IXYS CORPORATION, All Rights Reserved
IXYS REF: T_3N50D2(3C)8-17-09-A

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