DM74S200N datasheet, PDF - EEWORLD Datasheet

DM74S200N: DescriptionIC,SRAM,256X1,TTL,DIP,16PIN,PLASTIC; Categorystorage storage; File Size212KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

Stay tuned Parametric Compare

DM74S200N Overview

IC,SRAM,256X1,TTL,DIP,16PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Maximum access time	50 ns
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
Memory IC Type	STANDARD SRAM
memory width	1
Number of terminals	16
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	DM74S200N	DM74S200N/B+	DM54S200J/883
Description	IC,SRAM,256X1,TTL,DIP,16PIN,PLASTIC	IC,SRAM,256X1,TTL,DIP,16PIN,PLASTIC	IC,SRAM,256X1,TTL,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknow
Maximum access time	50 ns	50 ns	70 ns
JESD-30 code	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1
Number of terminals	16	16	16
word count	256 words	256 words	256 words
character code	256	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	125 °C
organize	256X1	256X1	256X1
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO
technology	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components