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APB2 is responsible for AD, I/O, advanced TIM, and serial port 1.
APB1 is responsible for DA, USB, SPI, I2C, CAN, serial port 2345, and common TIM
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The new product S1800CN multi-stage dry roots pump made its debut at the 16th International Solar Photovoltaic and Smart Energy (Shanghai) Conference and Exhibition Continue to listen to the nee...[Details]
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In the design of single-chip microcomputer, ISP and ICP are two common and important concepts. ISP allows the single-chip microcomputer to erase or write the program on the circuit board in a sim...[Details]
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On the evening of March 30, Kosen Technology disclosed its 2020 annual report, achieving operating income of 3.467 billion yuan, a year-on-year increase of 62.98%; however, due to the terminal sales ...[Details]
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This chapter talks about using programs to control the level of the microcontroller's output I/O port, and then controlling peripheral devices. It should be noted that after the 51 microcontroller is ...[Details]
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The automatic door program design based on 51 single chip microcomputer and human infrared sensing module is shared with everyone The automatic door schematic and PCB diagram drawn by Altium Designe...[Details]
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The rightmost end of the above figure is the I/O pin, and the device on the left is inside the chip. Two diodes are connected in parallel to the I/O for protection. Note: Some of the pictures...[Details]
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Oscilloscope Power Measurement Application - Overview Power measurement and analysis from Keysight Technologies (formerly Agilent) 3000X Oscilloscopes, 4000X Oscilloscope Series, 6000 X-Series Oscill...[Details]
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According to Korea Electronic Times, in order to overcome the sluggish memory market conditions, Samsung Electronics plans to stop some NAND flash memory production equipment at its P1 factory in Pye...[Details]
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Includes new features to meet the needs of the rapidly growing electronic shelf label (ESL) market All features of the ultra-low power RivieraWaves Bluetooth 5.4 IP platform are certified, includin...[Details]
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One of my ways to learn new knowledge is: 1. First grasp the general framework, content and scope of the new thing; In short: clarify the structure and grasp the key points; 2. After seeing the knowl...[Details]
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1 Introduction
The shape parameters and spatial distribution information of actual cracks in materials are becoming increasingly important in nondestructive defect assessment. They indicate th...[Details]
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There is a vast world for automotive semiconductors, and there is much room for domestic production to contribute. In the first half of 2022, the semiconductor industry's strong growth that lasted ...[Details]
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The 2019 World New Energy Vehicle Conference just concluded. The top leader of the country sent a congratulatory letter, and State Councilor Wang Yong attended and delivered a speech. The conference ...[Details]
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On November 11, Bosch will present its latest innovations in the field of microelectronics at the Munich Electronica 2024. The focus of the exhibition is on components that improve occupant safety,...[Details]
Talking
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