EEWORLDEEWORLDEEWORLD

Part Number

Search

ECCM9AA12-20.000MTR

Description
QUARTZ CRYSTAL RESONATOR, 20MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
CategoryPassive components    Crystal/resonator   
File Size155KB,5 Pages
ManufacturerECLIPTEK
Websitehttp://www.ecliptek.com
Environmental Compliance
Download Datasheet Parametric View All

ECCM9AA12-20.000MTR Overview

QUARTZ CRYSTAL RESONATOR, 20MHz, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

ECCM9AA12-20.000MTR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerECLIPTEK
package instructionROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Codecompliant
Other featuresAT-CUT CRYSTAL; TAPE AND REEL
Ageing3 PPM/YEAR
Crystal/Resonator TypePARALLEL - FUNDAMENTAL
Drive level10 µW
frequency stability0.01%
frequency tolerance50 ppm
JESD-609 codee4
load capacitance12 pF
Manufacturer's serial numberECCM9
Installation featuresSURFACE MOUNT
Nominal operating frequency20 MHz
Maximum operating temperature70 °C
Minimum operating temperature
physical sizeL5.0XB3.2XH1.0 (mm)/L0.197XB0.126XH0.039 (inch)
Series resistance50 Ω
surface mountYES
Terminal surfaceNickel/Gold (Ni/Au)

ECCM9AA12-20.000MTR Preview

ECCM9AA12-20.000M TR
Series
RoHS Compliant (Pb-free) 3.2mm x 5mm Ceramic SMD
Crystal
Frequency Tolerance/Stability
±50ppm at 25°C, ±100ppm over 0°C to +70°C
Mode of Operation
AT-Cut Fundamental
RoHS
Pb
Packaging Options
Tape & Reel
ECCM9 A A 12 -20.000M TR
Nominal Frequency
20.000MHz
Load Capacitance
12pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
Aging at 25°C
Load Capacitance
Shunt Capacitance (C0)
Equivalent Series Resistance
Mode of Operation
Drive Level
Crystal Cut
Spurious Response
Storage Temperature Range
Insulation Resistance
20.000MHz
±50ppm at 25°C, ±100ppm over 0°C to +70°C
±3ppm/Year Maximum
12pF Parallel Resonant
7pF Maximum
50 Ohms Maximum
AT-Cut Fundamental
100µWatts Maximum, 10µWatts Correlation
AT-Cut
>3dB from Fo to Fo+5000ppm
-40°C to +125°C
500 Megaohms Minimum at 100Vdc
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Flammability
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500V
MIL-STD-883, Method 1014, Condition A
UL94-V0
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Crystal
Cover/Ground
Crystal
Cover/Ground
3.2
±0.2
MARKING
ORIENTATION
3
5.0
±0.2
4
2
1
1.4 ±0.1
1.2 ±0.1 (X4)
2
3
4
2
2.6
±0.1
3
LINE MARKING
1
2
E20.00
E=Ecliptek
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
1
1.0
MAX
1
4
0.9 ±0.1
(X4)
Note: Chamfer not shown.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 1 of 5
ECCM9AA12-20.000M TR
Suggested Solder Pad Layout
All Dimensions in Millimeters
1.2 (X4)
1.5 (X4)
2.3
Solder Land
(X4)
1.0
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 2 of 5
ECCM9AA12-20.000M TR
Tape & Reel Dimensions
Quantity Per Reel: 1,000 units
4.0 ±0.2
2.0 ±0.2
DIA 1.5 ±0.1
0.30 ±0.05
7.5 ±0.2
16.0 ±0.3
6.75 ±0.20
5.7
±0.1
8.0 ±0.2
*Compliant to EIA 481A
3.8 ±0.1
1.4 ±0.1
1.5 MIN
DIA 40 MIN
Access Hole at
Slot Location
18.4 MAX
180 MAX
DIA 50 MIN
DIA 20.2 MIN
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
12.4 +2.0/-0
DIA 13.0 ±0.2
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 3 of 5
ECCM9AA12-20.000M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 seconds
6°C/second Maximum
8 minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 4 of 5
ECCM9AA12-20.000M TR
Recommended Solder Reflow Methods
T
P
Critical Zone
T
L
to T
P
Ramp-up
Ramp-down
Temperature (T)
T
L
T
S
Max
T
S
Min
t
S
Preheat
t 25°C to Peak
t
L
t
P
Time (t)
Low Temperature Infrared/Convection 240°C
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
5°C/second Maximum
N/A
150°C
N/A
60 - 120 Seconds
5°C/second Maximum
150°C
200 Seconds Maximum
240°C Maximum
240°C Maximum 1 Time / 230°C Maximum 2 Times
10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
5°C/second Maximum
N/A
Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev H 8/12/2010 | Page 5 of 5
The difference between ordinary diode and Zener diode
[indent][align=left]Diodes are common devices in circuit design, but there are many types of diodes, such as ordinary diodes, Zener diodes, Schottky diodes, etc. So what are the differences between th...
manhuami2007 Power technology
Why not promote the monopoly of shared bicycles?
Shared bikes are really good, and provide a very good experience for users. But why are they still so bad? In fact, it is because of competition. If one company could monopolize the operation and turn...
led2015 Talking
Violent disassembly of TMS320F28379D
[i=s]This post was last edited by littleshrimp on 2020-6-7 11:44[/i]https://www.bilibili.com/video/BV1EZ4y1W7Sb/...
littleshrimp Making friends through disassembly
New WiFi 6E and WiFi 7 standards: markets and applications
WiFi has been expanding its capacity and applications from computers and networks to mobile, consumer, and IoT-related devices. The WiFi industry set the WiFi 6 standard to cover low-power IoT nodes a...
石榴姐 RF/Wirelessly
[AB32VG1 development board review] Light up RGB_LED
There is an RGB_LED on the AB32VG1 development board. The schematic diagram of the RGB_LED is shown in Figure 1, through which you can learn how to use GPIO.Figure 1 RGB_LED circuit The pin connection...
jinglixixi Domestic Chip Exchange

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号