Dual-Port SRAM, 512KX72, 13ns, CMOS, PBGA484, 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Parts packaging code | BGA |
package instruction | 27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484 |
Contacts | 484 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 13 ns |
Other features | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | S-PBGA-B484 |
JESD-609 code | e0 |
length | 27 mm |
memory density | 37748736 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 72 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 484 |
word count | 524288 words |
character code | 512000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX72 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA484,22X22,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 220 |
power supply | 1.5/1.8 V |
Certification status | Not Qualified |
Maximum seat height | 2.46 mm |
Maximum standby current | 0.7 A |
Minimum standby current | 1.4 V |
Maximum slew rate | 1.55 mA |
Maximum supply voltage (Vsup) | 1.58 V |
Minimum supply voltage (Vsup) | 1.42 V |
Nominal supply voltage (Vsup) | 1.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 27 mm |