Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5554
Rev. 4, May 2012
MPC5554
Microcontroller Data Sheet
by: Microcontroller Division
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5554
microcontroller device. For functional characteristics,
refer to the
MPC5553/MPC5554 Microcontroller
Reference Manual.
Contents
1
2
3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . 5
3.3 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 EMI (Electromagnetic Interference) Characteristics 8
3.5 ESD (Electromagnetic Static Discharge) Characteris-
tics9
3.6 Voltage Regulator Controller (VRC) and
Power-On Reset (POR) Electrical Specifications9
3.7 Power-Up/Down Sequencing . . . . . . . . . . . . . . . . 10
3.8 DC Electrical Specifications. . . . . . . . . . . . . . . . . . 14
3.9 Oscillator and FMPLL Electrical Characteristics . . 20
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 22
3.11 H7Fa Flash Memory Electrical Characteristics . . . 23
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.1 MPC5553546667 416 PBGA Pinout . . . . . . . . . . . 45
4.2 MPC5554 416-Pin Package Dimensions . . . . . . . 52
Revision History for the MPC5554 Data Sheet . . . . . . 54
5.1 Changes between Revision 3 and Revision 4 . . . . 54
5.2 Changes between Revision 2 and Revision 3 . . . . 54
1
Overview
The MPC5554 microcontroller (MCU) is a member of
the MPC5500 family of microcontrollers built on the
Power Architecture
embedded technology. This family
of parts has many new features coupled with high
performance CMOS technology to provide substantial
reduction of cost per feature and significant performance
improvement over the MPC500 family.
The host processor core of this device complies with the
Power Architecture embedded category that is 100%
user-mode compatible (including floating point library)
with the original PowerPC instruction set. The embedded
architecture enhancements improve the performance in
embedded applications. The core also has additional
instructions, including digital signal processing (DSP)
instructions, beyond the original PowerPC instruction
set.
4
5
© Freescale Semiconductor, Inc., 2008,2012. All rights reserved.
Overview
The MPC5500 family of parts contains many new features coupled with high performance CMOS
technology to provide significant performance improvement over the MPC565.
The MPC5554 has two levels of memory hierarchy. The fastest accesses are to the 32-kilobytes (KB)
unified cache. The next level in the hierarchy contains the 64-KB on-chip internal SRAM and
two-megabytes (MB) internal flash memory. The internal SRAM and flash memory hold instructions and
data. The external bus interface is designed to support most of the standard memories used with the
MPC5xx family.
The complex input/output timer functions of the MPC5554 are performed by two enhanced time processor
unit (eTPU) engines. Each eTPU engine controls 32 hardware channels, providing a total of 64 hardware
channels. The eTPU has been enhanced over the TPU by providing: 24-bit timers, double-action hardware
channels, variable number of parameters per channel, angle clock hardware, and additional control and
arithmetic instructions. The eTPU is programmed using a high-level programming language.
The less complex timer functions of the MPC5554 are performed by the enhanced modular input/output
system (eMIOS). The eMIOS’ 24 hardware channels are capable of single-action, double-action,
pulse-width modulation (PWM), and modulus-counter operations. Motor control capabilities include
edge-aligned and center-aligned PWM.
Off-chip communication is performed by a suite of serial protocols including controller area networks
(FlexCANs), enhanced deserial/serial peripheral interfaces (DSPIs), and enhanced serial communications
interfaces (eSCIs). The DSPIs support pin reduction through hardware serialization and deserialization of
timer channels and general-purpose input/output (GPIOs) signals.
The MCU has an on-chip enhanced queued dual analog-to-digital converter (eQADC). 324 s40-channels.
The system integration unit (SIU) performs several chip-wide configuration functions. Pad configuration
and general-purpose input and output (GPIO) are controlled from the SIU. External interrupts and reset
control are also determined by the SIU. The internal multiplexer submodule provides multiplexing of
eQADC trigger sources, daisy chaining the DSPIs, and external interrupt signal multiplexing.
MPC5554 Microcontroller Data Sheet, Rev. 4
2
Freescale Semiconductor
Ordering Information
2
Ordering Information
M PC 5554 M ZP 80 R 2
Qualification status
Core code
Device number
Temperature range
Package identifier
Operating frequency (MHz)
Tape and reel status
Operating Frequency
80 = 80 MHz
112 = 112 MHz
132 = 132 MHz
Tape and Reel Status
R2 = Tape and reel
(blank) = Trays
Qualification Status
P = Pre qualification
M = Fully spec. qualified
Temperature Range
M = –40° C to 125° C
A = –55° C to 125° C
Package Identifier
ZP = 416PBGA SnPb
VR = 416PBGA Pb-free
Note:
Not all options are available on all devices. Refer to
Table 1.
Figure 1. MPC5500 Family Part Number Example
Unless noted in this data sheet, all specifications apply from T
L
to T
H
.
Table 1. Orderable Part Numbers
Freescale Part Number
MPC5554MVR132
MPC5554MVR112
MPC5554MVR80
MPC5554AVR132
MPC5554MZP132
MPC5554MZP112
MPC5554MZP80
MPC5554AZP132
1
2
3
1
Speed (MHz)
Package Description
Nominal
132
MPC5554 416 package
Lead-free (PbFree)
112
80
132
132
MPC5554 416 package
Leaded (SnPb)
112
80
132
Max.
3
(f
MAX
)
132
114
82
132
132
114
82
132
Operating Temperature
2
Min. (T
L
)
Max. (T
H
)
–40° C
125° C
–55° C
125° C
–40° C
125° C
–55° C
125° C
All devices are PPC5554, rather than MPC5554, until product qualifications are complete. Not all configurations are available in
the PPC parts.
The lowest ambient operating temperature is referenced by T
L
; the highest ambient operating temperature is referenced by T
H
.
Speed is the nominal maximum frequency. Max. speed is the maximum speed allowed including frequency modulation (FM).
82 MHz parts allow for 80 MHz system clock + 2% FM; 114 MHz parts allow for 112 MHz system clock + 2% FM; and132 MHz
parts allow for 128 MHz system clock + 2% FM.
MPC5554 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
3
Electrical Characteristics
3
Electrical Characteristics
This section contains detailed information on power considerations, DC/AC electrical characteristics, and
AC timing specifications for the MCU.
3.1
Spec
1
2
4
5
6
7
8
9
10
11
12
Maximum Ratings
Table 2. Absolute Maximum Ratings
1
Characteristic
1.5 V core supply voltage
2
Flash program/erase voltage
Flash read voltage
SRAM standby voltage
Clock synthesizer voltage
3.3 V I/O buffer voltage
Voltage regulator control input voltage
Analog supply voltage (reference to V
SSA
)
I/O supply voltage (fast I/O pads)
3
I/O supply voltage (slow and medium I/O pads)
3
DC input voltage
4
V
DDEH
powered I/O pads
V
DDE
powered I/O pads
Analog reference high voltage (reference to V
RL
)
V
SS
to V
SSA
differential voltage
V
DD
to V
DDA
differential voltage
V
REF
differential voltage
V
RH
to V
DDA
differential voltage
V
RL
to V
SSA
differential voltage
V
DDEH
to V
DDA
differential voltage
V
DDF
to V
DD
differential voltage
V
SSSYN
to V
SS
differential voltage
V
RCVSS
to V
SS
differential voltage
Maximum DC digital input current
8
(per pin, applies to all digital pins)
4
Maximum DC analog input current
9
(per pin, applies to all analog pins)
Maximum operating temperature range
10
Die junction temperature
Storage temperature range
Symbol
V
DD
V
PP
V
FLASH
V
STBY
V
DDSYN
V
DD33
V
RC33
V
DDA
V
DDE
V
DDEH
V
IN
Min.
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–1.0
5
–1.0
5
–0.3
–0.1
–V
DDA
–0.3
–5.5
–0.3
–V
DDA
–0.3
Max.
1.7
6.5
4.6
1.7
4.6
4.6
4.6
5.5
4.6
6.5
6.5
6
4.6
7
5.5
0.1
V
DD
5.5
5.5
0.3
V
DDEH
0.3
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
V
RH
V
SS
– V
SSA
V
DD
– V
DDA
V
RH
– V
RL
V
RH
– V
DDA
V
RL
– V
SSA
V
DDEH
– V
DDA
V
DDF
– V
DD
V
SSSYN
– V
SS
V
RCVSS
– V
SS
I
MAXD
I
MAXA
T
J
T
STG
V
RC33
to V
DDSYN
differential voltage spec has been moved to
Table 9
DC Electrical Specifications, Spec 43a.
–0.1
–0.1
–2
–3
T
L
–55.0
0.1
0.1
2
3
150.0
150.0
V
V
mA
mA
o
C
o
C
MPC5554 Microcontroller Data Sheet, Rev. 4
4
Freescale Semiconductor
Electrical Characteristics
Table 2. Absolute Maximum Ratings
1
(continued)
Spec
28
Characteristic
Maximum solder temperature
11
Lead free (Pb-free)
Leaded (SnPb)
Moisture sensitivity level
12
Symbol
T
SDR
MSL
Min.
—
—
—
Max.
260.0
245.0
3
Unit
o
C
29
1
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond any of the listed maxima can affect device reliability
or cause permanent damage to the device.
2
1.5 V ± 10% for proper operation. This parameter is specified at a maximum junction temperature of 150
o
C.
3
All functional non-supply I/O pins are clamped to V
SS
and V
DDE
, or V
DDEH
.
4
AC signal overshoot and undershoot of up to ± 2.0 V of the input voltages is permitted for an accumulative duration of
60 hours over the complete lifetime of the device (injection current not limited for this duration).
5
Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met. Keep the negative DC
voltage greater than –0.6 V on eTPUB[15] and SINB during the internal power-on reset (POR) state.
6
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDEH
supplies, if the
maximum injection current specification is met (2 mA for all pins) and V
DDEH
is within the operating voltage specifications.
7
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
DDE
supplies, if the maximum
injection current specification is met (2 mA for all pins) and V
DDE
is within the operating voltage specifications.
8
Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
9
Total injection current for all analog input pins must not exceed 15 mA.
10
Lifetime operation at these specification limits is not guaranteed.
11
Moisture sensitivity profile per IPC/JEDEC J-STD-020D.
12
Moisture sensitivity per JEDEC test method A112.
3.2
Thermal Characteristics
Table 3. MPC5554 Thermal Characteristics
The shaded rows in the following table indicate information specific to a four-layer board.
Spec
1
2
3
4
5
6
7
1
MPC5554 Thermal Characteristic
Junction to ambient
1, 2
, natural convection (one-layer board)
Junction to ambient
1, 3
, natural convection (four-layer board 2s2p)
Junction to ambient
1, 3
(@200 ft./min., one-layer board)
Junction to ambient
1, 3
(@200 ft./min., four-layer board 2s2p)
Junction to board
4
(four-layer board 2s2p)
Junction to case
5
Junction to package top
6
, natural convection
Symbol
R
JA
R
JA
R
JMA
R
JMA
R
JB
R
JC
JT
416
PBGA
24
18
19
15
9
5
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
2
3
4
5
6
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
MPC5554 Microcontroller Data Sheet, Rev. 4
Freescale Semiconductor
5
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