LM3S1968-IQC50-A2T datasheet, PDF

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LM3S1968-IQC50-A2T: DescriptionStellaris LM3S Microcontroller 100-LQFP -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，709 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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LM3S1968-IQC50-A2T Overview

Stellaris LM3S Microcontroller 100-LQFP -40 to 85

LM3S1968-IQC50-A2T Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	QFP
package instruction	LFQFP, QFP100,.63SQ,20
Contacts	100
Reach Compliance Code	compli
Factory Lead Time	16 weeks
Samacsys Descripti	Stellaris Microcontrolle
Has ADC	YES
Address bus width
bit size	32
boundary scan	YES
CPU series	CORTEX-M3
maximum clock frequency	0.032 MHz
DAC channel	NO
DMA channel	NO
External data bus width
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PQFP-G100
JESD-609 code	e3
length	14 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels
Number of external interrupt devices
Number of I/O lines	52
Number of serial I/Os	6
Number of terminals	100
Number of timers	4
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2.5,3.3 V
Certification status	Not Qualified
RAM (bytes)	65536
rom(word)	262144
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	50 MHz
Maximum supply voltage	2.75 V
Minimum supply voltage	2.25 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

LM3S1968-IQC50-A2T Related Products

	LM3S1968-IQC50-A2T	LM3S1968-IQC50-A2	LM3S1968-IBZ50-A2	LM3S1968-IBZ50-A2T
Description	Stellaris LM3S Microcontroller 100-LQFP -40 to 85	Stellaris LM3S Microcontroller 100-LQFP -40 to 85	Stellaris LM3S Microcontroller 108-NFBGA -40 to 85	Stellaris LM3S Microcontroller 108-NFBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	QFP	QFP	BGA	BGA
package instruction	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20	LFBGA, BGA108,12X12,32	LFBGA, BGA108,12X12,32
Contacts	100	100	108	108
Reach Compliance Code	compli	compli	compli	compli
Factory Lead Time	16 weeks	8 weeks	16 weeks	16 weeks
Has ADC	YES	YES	YES	YES
bit size	32	32	32	32
boundary scan	YES	YES	YES	YES
CPU series	CORTEX-M3	CORTEX-M3	CORTEX-M3	CORTEX-M3
maximum clock frequency	0.032 MHz	0.032 MHz	0.032 MHz	0.032 MHz
DAC channel	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES	YES
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PBGA-B108	S-PBGA-B108
JESD-609 code	e3	e3	e1	e1
length	14 mm	14 mm	10 mm	10 mm
low power mode	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3
Number of I/O lines	52	52	52	52
Number of serial I/Os	6	6	6	6
Number of terminals	100	100	108	108
Number of timers	4	4	4	4
On-chip data RAM width	8	8	8	8
On-chip program ROM width	8	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFBGA	LFBGA
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	BGA108,12X12,32	BGA108,12X12,32
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	65536	65536	65536	65536
rom(word)	262144	262144	262144	262144
ROM programmability	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.6 mm	1.6 mm	1.5 mm	1.5 mm
speed	50 MHz	50 MHz	50 MHz	50 MHz
Maximum supply voltage	2.75 V	2.75 V	2.75 V	2.75 V
Minimum supply voltage	2.25 V	2.25 V	2.25 V	2.25 V
Nominal supply voltage	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	GULL WING	GULL WING	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm	0.8 mm	0.8 mm
Terminal location	QUAD	QUAD	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	10 mm	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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