NOR Gate 2-Element 2-IN CMOS 8-Pin SSOP T/R
| Parameter Name | Attribute value |
| EU restricts the use of certain hazardous substances | Compliant |
| Part Status | Obsolete |
| Logic Family | LVC |
| Logic Function | NOR |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2-IN |
| Number of Output Enables per Element | 0 |
| Number of Selection Inputs per Element | 0 |
| Number of Element Outputs | 1 |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 4.4@5V|4.9@3.3V |
| Absolute Propagation Delay Time (ns) | 8.9 |
| Process Technology | CMOS |
| Output Type | Push-Pull |
| Maximum Low Level Output Current (mA) | 32 |
| Maximum High Level Output Current (mA) | -32 |
| Minimum Operating Supply Voltage (V) | 1.65 |
| Typical Operating Supply Voltage (V) | 5|3.3|2.5|1.8 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Maximum Quiescent Current (uA) | 10 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tape and Reel |
| Standard Package Name | SOP |
| Supplier Package | SSOP |
| Pin Count | 8 |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) |
| Package Length | 3.15(Max) |
| Package Width | 2.9(Max) |
| PCB changed | 8 |
| Lead Shape | Gull-wing |
| SN74LVC2G02DCTRG4 | SN74LVC2G02DCUT | SN74LVC2G02YZPR | SN74LVC2G02DCUTE4 | SN74LVC2G02DCURE4 | SN74LVC2G02DCTRE4 | SN74LVC2G02YEPR | |
|---|---|---|---|---|---|---|---|
| Description | NOR Gate 2-Element 2-IN CMOS 8-Pin SSOP T/R | NOR Gate 2-Element 2-IN CMOS 8-Pin VSSOP T/R | Dual 2-Input Positive-NOR Gate 8-DSBGA -40 to 125 | Logic Gates Dual 2 Input Pos NOR Gate | Logic Gates Dual 2-Input Pos | Dual 2-Input Positive-NOR Gate 8-SM8 -40 to 125 | IC GATE NOR 2CH 2-INP 8DSBGA |
| Brand Name | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| Is it lead-free? | - | - | Lead free | Contains lead | Contains lead | Lead free | - |
| Is it Rohs certified? | - | - | conform to | conform to | conform to | conform to | incompatible |
| Maker | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | - | - | BGA | SOIC | SOIC | SOIC | BGA |
| package instruction | - | - | VFBGA, BGA8,2X4,20 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 | LSSOP, SSOP8,.16 | VFBGA, BGA8,2X4,20 |
| Contacts | - | - | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | - | - | compli | compli | compli | compli | not_compliant |
| series | - | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 code | - | - | R-PBGA-B8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-XBGA-B8 |
| JESD-609 code | - | - | e1 | e4 | e4 | e4 | - |
| length | - | - | 1.9 mm | 2.3 mm | 2.3 mm | 2.95 mm | 1.9 mm |
| Load capacitance (CL) | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | - | - | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
| MaximumI(ol) | - | - | 0.032 A | 0.024 A | 0.024 A | 0.032 A | 0.024 A |
| Humidity sensitivity level | - | - | 1 | 1 | 1 | 1 | - |
| Number of functions | - | - | 2 | 2 | 2 | 2 | 2 |
| Number of entries | - | - | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | - | - | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | - | - | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| Package body material | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| encapsulated code | - | - | VFBGA | VSSOP | VSSOP | LSSOP | VFBGA |
| Encapsulate equivalent code | - | - | BGA8,2X4,20 | TSSOP8,.12,20 | TSSOP8,.12,20 | SSOP8,.16 | BGA8,2X4,20 |
| Package shape | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing | - | - | TR | TAPE AND REEL | TAPE AND REEL | TR | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | - | - | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| power supply | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | - | - | 4.9 ns | 4.9 ns | 4.9 ns | 4.9 ns | - |
| propagation delay (tpd) | - | - | 8.9 ns | 8.9 ns | 8.9 ns | 8.9 ns | 8.9 ns |
| Certification status | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | - | - | NO | NO | NO | NO | NO |
| Maximum seat height | - | - | 0.5 mm | 0.9 mm | 0.9 mm | 1.3 mm | 0.5 mm |
| Maximum supply voltage (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| Nominal supply voltage (Vsup) | - | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| surface mount | - | - | YES | YES | YES | YES | YES |
| technology | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL |
| Terminal surface | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| Terminal form | - | - | BALL | GULL WING | GULL WING | GULL WING | BALL |
| Terminal pitch | - | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
| Terminal location | - | - | BOTTOM | DUAL | DUAL | DUAL | BOTTOM |
| Maximum time at peak reflow temperature | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | - | - | 0.9 mm | 2 mm | 2 mm | 2.8 mm | 0.9 mm |
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