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MSP430F438IPNR

Description
MSP430F43x Mixed Signal Microcontroller 80-LQFP -40 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,69 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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MSP430F438IPNR Overview

MSP430F43x Mixed Signal Microcontroller 80-LQFP -40 to 85

MSP430F438IPNR Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeQFP
package instructionLFQFP, QFP80,.55SQ,20
Contacts80
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time6 weeks
Has ADCYES
Address bus width
bit size16
boundary scanYES
CPU seriesMSP430
maximum clock frequency0.032 MHz
DAC channelNO
DMA channelYES
External data bus width
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeS-PQFP-G80
JESD-609 codee4
length12 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels1
Number of external interrupt devices
Number of I/O lines48
Number of serial I/Os1
Number of terminals80
Number of timers7
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Encapsulate equivalent codeQFP80,.55SQ,20
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
power supply2/3.3 V
Certification statusNot Qualified
RAM (bytes)2048
RAM (number of words)2
rom(word)49152
ROM programmabilityFLASH
Maximum seat height1.6 mm
speed8 MHz
Maximum slew rate0.57 mA
Maximum supply voltage3.6 V
Minimum supply voltage1.8 V
Nominal supply voltage2.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width12 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER, RISC
Base Number Matches1

MSP430F438IPNR Related Products

MSP430F438IPNR MSP430F438IPN MSP430F439IPN MSP430F439IPNR
Description MSP430F43x Mixed Signal Microcontroller 80-LQFP -40 to 85 MSP430F43x Mixed Signal Microcontroller 80-LQFP -40 to 85 MSP430F43x Mixed Signal Microcontroller 80-LQFP -40 to 85 MSP430F43x Mixed Signal Microcontroller 80-LQFP -40 to 85
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code QFP QFP QFP QFP
package instruction LFQFP, QFP80,.55SQ,20 LFQFP, QFP80,.55SQ,20 LFQFP, QFP80,.55SQ,20 LFQFP, QFP80,.55SQ,20
Contacts 80 80 80 80
Reach Compliance Code compli compli compli compli
Factory Lead Time 6 weeks 1 week 6 weeks 8 weeks
Has ADC YES YES YES YES
bit size 16 16 16 16
boundary scan YES YES YES YES
CPU series MSP430 MSP430 MSP430 MSP430
maximum clock frequency 0.032 MHz 0.032 MHz 0.032 MHz 0.032 MHz
DAC channel NO NO NO NO
DMA channel YES YES YES YES
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO NO
JESD-30 code S-PQFP-G80 S-PQFP-G80 S-PQFP-G80 S-PQFP-G80
JESD-609 code e4 e4 e4 e4
length 12 mm 12 mm 12 mm 12 mm
low power mode YES YES YES YES
Humidity sensitivity level 3 3 3 3
Number of DMA channels 1 1 1 1
Number of I/O lines 48 48 48 48
Number of serial I/Os 1 1 1 1
Number of terminals 80 80 80 80
Number of timers 7 7 7 7
On-chip data RAM width 8 8 8 8
On-chip program ROM width 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
PWM channel YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFQFP LFQFP
Encapsulate equivalent code QFP80,.55SQ,20 QFP80,.55SQ,20 QFP80,.55SQ,20 QFP80,.55SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 2/3.3 V 2/3.3 V 2/3.3 V 2/3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 2048 2048 2048 2048
RAM (number of words) 2 2 2 2
rom(word) 49152 49152 61440 61440
ROM programmability FLASH FLASH FLASH FLASH
Maximum seat height 1.6 mm 1.6 mm 1.6 mm 1.6 mm
speed 8 MHz 8 MHz 8 MHz 8 MHz
Maximum slew rate 0.57 mA 0.57 mA 0.57 mA 0.57 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage 2.2 V 2.2 V 2.2 V 2.2 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 12 mm 12 mm 12 mm 12 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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