IS46TR16256AL-15HBLA2 datasheet, PDF

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IS46TR16256AL-15HBLA2: DescriptionDDR DRAM, 256MX16, 0.125ns, CMOS, PBGA96, 9 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-96; Categorystorage storage; File Size3MB，88 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS46TR16256AL-15HBLA2 Overview

DDR DRAM, 256MX16, 0.125ns, CMOS, PBGA96, 9 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-96

IS46TR16256AL-15HBLA2 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
package instruction	TFBGA, BGA96,9X16,32
Reach Compliance Code	compliant
Factory Lead Time	8 weeks
access mode	MULTI BANK PAGE BURST
Maximum access time	0.125 ns
Other features	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	667 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B96
length	13 mm
memory density	4294967296 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	96
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
organize	256MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA96,9X16,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
power supply	1.35 V
Certification status	Not Qualified
refresh cycle	8192
Filter level	AEC-Q100
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	4,8
Maximum standby current	0.016 A
Maximum slew rate	0.207 mA
Maximum supply voltage (Vsup)	1.45 V
Minimum supply voltage (Vsup)	1.283 V
Nominal supply voltage (Vsup)	1.35 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	9 mm

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Description	DDR DRAM, 256MX16, 0.125ns, CMOS, PBGA96, 9 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-96	DDR DRAM, 256MX16, 0.1ns, CMOS, PBGA96, FBGA-96	DDR DRAM, 256MX16, 0.125ns, CMOS, PBGA96, FBGA-96	DDR DRAM, 256MX16, 0.1ns, CMOS, PBGA96, 9 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-96	DDR DRAM, 256MX16, 0.1ns, CMOS, PBGA96, 9 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-96	DDR DRAM, 256MX16, 0.1ns, CMOS, PBGA96, FBGA-96	DDR DRAM, 256MX16, 0.125ns, CMOS, PBGA96, FBGA-96	DDR DRAM, 256MX16, 0.125ns, CMOS, PBGA96, 9 X 13 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-96	DDR DRAM, 512MX8, 0.255ns, CMOS, PBGA78, 9 X 10.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-78
package instruction	TFBGA, BGA96,9X16,32	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA, BGA96,9X16,32	TFBGA,	TFBGA,	TFBGA,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compli	compli	unknow
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Maximum access time	0.125 ns	0.1 ns	0.125 ns	0.1 ns	0.1 ns	0.1 ns	0.125 ns	0.125 ns	0.255 ns
Other features	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B96	R-PBGA-B78
length	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	10.5 mm
memory density	4294967296 bit	4294967296 bit	4294967296 bit	4294967296 bit	4294967296 bit	4294967296 bit	4294967296 bi	4294967296 bi	4294967296 bi
Memory IC Type	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
memory width	16	16	16	16	16	16	16	16	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	96	96	96	96	96	96	96	96	78
word count	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	536870912 words
character code	256000000	256000000	256000000	256000000	256000000	256000000	256000000	256000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	105 °C	85 °C	85 °C	85 °C	85 °C	105 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C	-	-40 °C	-
organize	256MX16	256MX16	256MX16	256MX16	256MX16	256MX16	256MX16	256MX16	512MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.45 V	1.575 V	1.575 V	1.45 V	1.45 V	1.575 V	1.575 V	1.45 V	1.45 V
Minimum supply voltage (Vsup)	1.283 V	1.425 V	1.425 V	1.283 V	1.283 V	1.425 V	1.425 V	1.283 V	1.283 V
Nominal supply voltage (Vsup)	1.35 V	1.5 V	1.5 V	1.35 V	1.35 V	1.5 V	1.5 V	1.35 V	1.35 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER	INDUSTRIAL	OTHER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	-
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	-	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Factory Lead Time	8 weeks	6 weeks	6 weeks	-	6 weeks	8 weeks	6 weeks	6 weeks	13 weeks 6 days

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