NIS02D1N0TRF datasheet, PDF - EEWORLD Datasheet

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NIS02D1N0TRF: DescriptionGeneral Purpose Inductor, 0.001uH, 30%, 1 Element, Alumina-Core, SMD, 0201, CHIP, 0201, ROHS COMPLIANT; CategoryPassive components inductor; File Size124KB，4 Pages; ManufacturerNichicon; Websitehttp://www.nichicon.co.jp; Environmental Compliance

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NIS02D1N0TRF Overview

General Purpose Inductor, 0.001uH, 30%, 1 Element, Alumina-Core, SMD, 0201, CHIP, 0201, ROHS COMPLIANT

NIS02D1N0TRF Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Nichicon
package instruction	CHIP, 0201, ROHS COMPLIANT
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	12 weeks 4 days
uppercase and lowercase codes	0201
core material	ALUMINA
DC Resistance	0.12 Ω
Nominal inductance(L)	0.001 µH
Inductor Applications	RF INDUCTOR
Inductor type	GENERAL PURPOSE INDUCTOR
JESD-609 code	e3
Number of functions	1
Number of terminals	2
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Minimum quality factor (at nominal inductance)	4
Maximum rated current	0.55 A
self resonant frequency	20000 MHz
Shape/Size Description	RECTANGULAR PACKAGE
shield	NO
special characteristics	INDUCTANCE TOLERANCE IS 0.3 NANO HENRY
surface mount	YES
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal location	DUAL ENDED
Terminal shape	WRAPAROUND
Test frequency	100 MHz
Tolerance	30%

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0201/0402/0603 Chip Inductors

FEATURES

•

LASER CUT SPIRAL COIL OVER ALUMINA CORE

SUPER MINIATURE EIA 0201, 0402 & 0603 SIZE IN RESIN ENCLOSED BODY

HIGH Q AND SRF FOR HIGH FREQUENCY APPLICATIONS

TIGHT TOLERANCES (D ± 0.3nH, G ± 2% or J ± 5%)

BOTH FLOW AND REFLOW SOLDERING APPLICABLE

EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE

Inductance Range

1.0 ~ 220nH

D (±0.3nH), G (±2%)

J (±5%)

-40

~ +85

See Individual

Product Listings

NIS Series

SPECIFICATIONS

SURFACE MOUNT

Inductance Tolerances

Operating Temperature Range

Q-Factor, Self Resonant Frequency,

DC Resistance, Rated DC Current

and Inductance Tolerance

ENVIRONMENTAL CHARACTERISTICS

Test

Solderability

Humidity Resistance

Specification

90% Min. Coverage

Test Method & Condition

After 3 Sec. Dip in +230

C Solder Pot (Post Flux)

After 500 Hrs at 60

C and 90-95% RH (No Load)

After 10 Seconds at +260

C (5 Min, 120

Pre-Heat)

After 2 Hrs per Axis, 10~55Hz, 1.5mm Amplitude

After 100 Cycles (-40

to +85

C) 30 Min. Each

After 500 Hrs at -40

After 500 Hrs at 85

C with Rated DC Current

After 500 Hrs at 60

C with 90-95%RH

with Rated DC Current

(1) No Evidence of Damage

(2) Inductance Shall Be

Soldering Effect

Within + 5% of Initial

Value

Low Frequency Vibration

(3) Q Factor Shall Be Within

Thermal Shock

±20% of Initial Value

(±25% for 0201 size)

Low Temperature Storage

(1) No Evidence of Damage

High Temperature Load

(2) Inductance Shall Be

Life

Within + 10% of Initial

Value

(3) Q Factor Shall Be Within

Humidity Load Life

±20% of Initial Value

PART NUMBERING SYSTEM

NIS04 J 22N TR F

Lead Free (Std NIS02, Optional

on NIS04/06) 100% Sn

Packaging: TR = Tape & Reel

Inductance Code (N=decimal point)

(Ex. 2N2=2.2nH, 33N=33nH)

Tolerance Code (D=±0.3nH, G=±2%, J=±5%)

Series (02=0201, 04=0402, 06=0603)

PART AND LAND PATTERN DIMENSIONS (mm)

Series

NIS02 0.6 +0.05 0.3 +0.05 0.3 +0.05 0.15 +0.05 0.26~0.30 0.75~0.80 0.28~0.35

NIS04 1.0 +0.05 0.5 +0.05 0.5 +0.05

NIS06 1.6 +0.15 0.8 +0.15 0.8 +0.15

0.2 +0.1

0.3 +0.2

0.5~0.6

0.8~1.0

1.5~1.7

2.0~2.6

0.5~0.6

0.7~0.9

Recommended land patterns for flow and reflow soldering

DIMENSION (mm)

Solder Plated Terminations

Resin Enclosure

NIS Chip

Land Pattern

236

NIC COMPONENTS

www.niccomp.com

www.lowESR.com

www.RFpassives.com

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