N82S191NB datasheet, PDF - EEWORLD Datasheet

N82S191NB: DescriptionIC 2K X 8 OTPROM, 80 ns, PDIP24, Programmable ROM; Categorystorage storage; File Size84KB，3 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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N82S191NB Overview

IC 2K X 8 OTPROM, 80 ns, PDIP24, Programmable ROM

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	80 ns
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	75 °C
Minimum operating temperature
organize	2KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	0.175 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	N82S191NB	N82S191ANB
Description	IC 2K X 8 OTPROM, 80 ns, PDIP24, Programmable ROM	IC 2K X 8 OTPROM, 55 ns, PDIP24, Programmable ROM
Is it Rohs certified?	incompatible	incompatible
Maker	NXP	NXP
package instruction	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	80 ns	55 ns
JESD-30 code	R-PDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0
memory density	16384 bit	16384 bit
Memory IC Type	OTP ROM	OTP ROM
memory width	8	8
Number of functions	1	1
Number of terminals	24	24
word count	2048 words	2048 words
character code	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	75 °C	75 °C
organize	2KX8	2KX8
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	0.175 mA	0.175 mA
Maximum supply voltage (Vsup)	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

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