|
SN74AUC1G07DBVT |
SN74AUC1G07DCKR |
SN74AUC1G07YZPR |
SN74AUC1G07DCKT |
SN74AUC1G07DBVRG4 |
SN74AUC1G07DCKRG4 |
SN74AUC1G07DBVRE4 |
SN74AUC1G07DCKTG4 |
Description |
Single Buffer/Driver With Open-Drain Output 5-SOT-23 -40 to 85 |
Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 |
Single Buffer/Driver With Open-Drain Output 5-DSBGA -40 to 85 |
Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 |
Single Buffer/Driver With Open-Drain Output 5-SOT-23 -40 to 85 |
Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 |
Single Buffer/Driver With Open-Drain Output 5-SOT-23 -40 to 85 |
Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Parts packaging code |
SOT-23 |
SOIC |
BGA |
SOIC |
SOT-23 |
SOIC |
SOT-23 |
SOIC |
package instruction |
LSSOP, TSOP5/6,.11,37 |
TSSOP, TSSOP5/6,.08 |
VFBGA, BGA5,2X3,20 |
TSSOP, TSSOP5/6,.08 |
LSSOP, TSOP5/6,.11,37 |
TSSOP, TSSOP5/6,.08 |
LSSOP, TSOP5/6,.11,37 |
TSSOP, TSSOP5/6,.08 |
Contacts |
5 |
5 |
5 |
5 |
5 |
5 |
5 |
5 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
compli |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
- |
Factory Lead Time |
1 week |
1 week |
1 week |
1 week |
6 weeks |
6 weeks |
6 weeks |
- |
series |
AUC |
AUC |
AUC |
AUC |
AUC |
- |
AUC |
AUC |
JESD-30 code |
R-PDSO-G5 |
R-PDSO-G5 |
R-PBGA-B5 |
R-PDSO-G5 |
R-PDSO-G5 |
- |
R-PDSO-G5 |
R-PDSO-G5 |
JESD-609 code |
e4 |
e4 |
e1 |
e4 |
e4 |
- |
e4 |
e4 |
length |
2.9 mm |
2 mm |
1.4 mm |
2 mm |
2.9 mm |
- |
2.9 mm |
2 mm |
Load capacitance (CL) |
15 pF |
15 pF |
15 pF |
15 pF |
15 pF |
- |
15 pF |
15 pF |
Logic integrated circuit type |
BUFFER |
BUFFER |
BUFFER |
BUFFER |
BUFFER |
- |
BUFFER |
BUFFER |
MaximumI(ol) |
0.009 A |
0.009 A |
0.009 A |
0.009 A |
0.009 A |
- |
0.009 A |
0.005 A |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
Number of entries |
1 |
1 |
1 |
1 |
1 |
- |
1 |
1 |
Number of terminals |
5 |
5 |
5 |
5 |
5 |
- |
5 |
5 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
- |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
-40 °C |
Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
OPEN-DRAIN |
- |
OPEN-DRAIN |
OPEN-DRAIN |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LSSOP |
TSSOP |
VFBGA |
TSSOP |
LSSOP |
- |
LSSOP |
TSSOP |
Encapsulate equivalent code |
TSOP5/6,.11,37 |
TSSOP5/6,.08 |
BGA5,2X3,20 |
TSSOP5/6,.08 |
TSOP5/6,.11,37 |
- |
TSOP5/6,.11,37 |
TSSOP5/6,.08 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing |
TR |
TR |
TR |
TR |
TR |
- |
TR |
TR |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
- |
260 |
260 |
power supply |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
1.2/2.5 V |
- |
1.2/2.5 V |
1.2/2.5 V |
Maximum supply current (ICC) |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
- |
0.01 mA |
- |
Prop。Delay @ Nom-Su |
3.3 ns |
3.3 ns |
3.3 ns |
3.3 ns |
3.3 ns |
- |
3.3 ns |
3.3 ns |
propagation delay (tpd) |
3.3 ns |
3.3 ns |
3.3 ns |
3.3 ns |
3.3 ns |
- |
3.3 ns |
3.3 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
NO |
NO |
- |
NO |
NO |
Maximum seat height |
1.45 mm |
1.1 mm |
0.5 mm |
1.1 mm |
1.45 mm |
- |
1.45 mm |
1.1 mm |
Maximum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
- |
2.7 V |
2.7 V |
Minimum supply voltage (Vsup) |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
0.8 V |
- |
0.8 V |
0.8 V |
Nominal supply voltage (Vsup) |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
1.2 V |
- |
1.2 V |
1.2 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
- |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
BALL |
GULL WING |
GULL WING |
- |
GULL WING |
GULL WING |
Terminal pitch |
0.95 mm |
0.65 mm |
0.5 mm |
0.65 mm |
0.95 mm |
- |
0.95 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
BOTTOM |
DUAL |
DUAL |
- |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
width |
1.6 mm |
1.25 mm |
0.9 mm |
1.25 mm |
1.6 mm |
- |
1.6 mm |
1.25 mm |
ECCN code |
- |
EAR99 |
EAR99 |
- |
EAR99 |
EAR99 |
EAR99 |
- |