|
CSD22204W |
CSD22204WT |
Description |
CSD22204W 8-V P-Channel NexFET Power MOSFET 9-DSBGA |
CSD22204W 8-V P-Channel NexFET Power MOSFET 9-DSBGA |
Brand Name |
Texas Instruments |
Texas Instruments |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Texas Instruments |
Texas Instruments |
package instruction |
1.50 X 1.50 MM, GREEN, DSBGA-9 |
1.50 X 1.50 MM, GREEN, DSBGA-9 |
Reach Compliance Code |
compliant |
compliant |
Factory Lead Time |
6 weeks |
6 weeks |
Configuration |
SINGLE WITH BUILT-IN DIODE AND RESISTOR |
SINGLE WITH BUILT-IN DIODE AND RESISTOR |
Minimum drain-source breakdown voltage |
8 V |
8 V |
Maximum drain current (ID) |
5 A |
5 A |
Maximum drain-source on-resistance |
0.014 Ω |
0.014 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
Maximum feedback capacitance (Crss) |
265 pF |
265 pF |
JESD-30 code |
S-XBGA-B9 |
S-XBGA-B9 |
JESD-609 code |
e1 |
e1 |
Humidity sensitivity level |
1 |
1 |
Number of components |
1 |
1 |
Number of terminals |
9 |
9 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
Polarity/channel type |
P-CHANNEL |
P-CHANNEL |
Maximum pulsed drain current (IDM) |
80 A |
80 A |
surface mount |
YES |
YES |
Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form |
BALL |
BALL |
Terminal location |
BOTTOM |
BOTTOM |
transistor applications |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |
Base Number Matches |
1 |
1 |