Triple Inverter Buffer/Driver with Open-Drain Output 8-SM8 -40 to 125
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | SOIC |
| package instruction | LSSOP, SSOP8,.16 |
| Contacts | 8 |
| Reach Compliance Code | compli |
| Factory Lead Time | 6 weeks |
| series | LVC/LCX/Z |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e4 |
| length | 2.95 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| MaximumI(ol) | 0.032 A |
| Humidity sensitivity level | 1 |
| Number of functions | 3 |
| Number of entries | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LSSOP |
| Encapsulate equivalent code | SSOP8,.16 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| method of packing | TR |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Maximum supply current (ICC) | 0.01 mA |
| Prop。Delay @ Nom-Su | 3.4 ns |
| propagation delay (tpd) | 7.2 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 1.3 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 2.8 mm |
| SN74LVC3G06DCTRE4 | SN74LVC3G06YZPR | SN74LVC3G06DCUT | SN74LVC3G06DCUR | SN74LVC3G06DCTR | SN74LVC3G06DCURG4 | |
|---|---|---|---|---|---|---|
| Description | Triple Inverter Buffer/Driver with Open-Drain Output 8-SM8 -40 to 125 | Triple Inverter Buffer/Driver with Open-Drain Output 8-DSBGA -40 to 85 | Triple Inverter Buffer/Driver with Open-Drain Output 8-VSSOP -40 to 125 | Triple Inverter Buffer/Driver with Open-Drain Output 8-VSSOP -40 to 125 | Triple Inverter Buffer/Driver with Open-Drain Output 8-SM8 -40 to 125 | Triple Inverter Buffer/Driver with Open-Drain Output 8-VSSOP -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | SOIC | BGA | SOIC | SOIC | SOIC | SOIC |
| package instruction | LSSOP, SSOP8,.16 | VFBGA, BGA8,2X4,20 | VSSOP-8 | VSSOP-8 | SSOP-8 | VSSOP, TSSOP8,.12,20 |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| Factory Lead Time | 6 weeks | 1 week | 1 week | 1 week | 1 week | 6 weeks |
| series | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 code | R-PDSO-G8 | R-XBGA-B8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e4 | e1 | e4 | e4 | e4 | e4 |
| length | 2.95 mm | 1.9 mm | 2.3 mm | 2.3 mm | 2.95 mm | 2.3 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| MaximumI(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of entries | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LSSOP | VFBGA | VSSOP | VSSOP | LSSOP | VSSOP |
| Encapsulate equivalent code | SSOP8,.16 | BGA8,2X4,20 | TSSOP8,.12,20 | TSSOP8,.12,20 | SSOP8,.16 | TSSOP8,.12,20 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| method of packing | TR | TR | TR | TR | TR | TR |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Maximum supply current (ICC) | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| Prop。Delay @ Nom-Su | 3.4 ns | 3.4 ns | 3.4 ns | 3.4 ns | 3.4 ns | 3.4 ns |
| propagation delay (tpd) | 7.2 ns | 7.2 ns | 7.2 ns | 7.2 ns | 7.2 ns | 7.2 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| Maximum seat height | 1.3 mm | 0.5 mm | 0.9 mm | 0.9 mm | 1.3 mm | 0.9 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING | BALL | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
| Terminal location | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 2.8 mm | 0.9 mm | 2 mm | 2 mm | 2.8 mm | 2 mm |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
