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AM2968A/BXA

Description
Memory Controller, TTL, CDIP48
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1019KB,24 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM2968A/BXA Overview

Memory Controller, TTL, CDIP48

AM2968A/BXA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
package instructionDIP, DIP48,.6
Reach Compliance Codecompliant
JESD-30 codeR-XDIP-T48
JESD-609 codee0
Number of terminals48
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP48,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Nominal supply voltage5 V
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

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Description Memory Controller, TTL, CDIP48 Memory Controller, TTL, PQCC68 Memory Controller, TTL, PDIP48 Memory Controller, TTL, CQCC68 Memory Controller, TTL, CQCC68 Memory Controller, TTL, CDFP48 Memory Controller, TTL, CDIP48 Memory Controller, TTL, CDIP48 Memory Controller, TTL, CQCC68 Memory Controller, TTL, CQCC68
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP48,.6 QCCJ, LDCC68,1.0SQ DIP, DIP48,.6 QCCN, LCC68,.95SQ QCCN, LCC68,.95SQ DFP, FL48,.6 DIP, DIP48,.6 DIP, DIP48,.6 QCCN, LCC68,.95SQ QCCN, LCC68,.95SQ
Reach Compliance Code compliant compli compli compliant compliant compliant compliant compliant compliant compliant
JESD-30 code R-XDIP-T48 S-PQCC-J68 R-PDIP-T48 S-XQCC-N68 S-XQCC-N68 R-XDFP-F48 R-XDIP-T48 R-XDIP-T48 S-XQCC-N68 S-XQCC-N68
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
Number of terminals 48 68 48 68 68 48 48 48 68 68
Maximum operating temperature 125 °C 70 °C 70 °C 125 °C 125 °C 125 °C 125 °C 125 °C 70 °C 70 °C
Minimum operating temperature -55 °C - - -55 °C -55 °C -55 °C -55 °C -55 °C - -
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP QCCJ DIP QCCN QCCN DFP DIP DIP QCCN QCCN
Encapsulate equivalent code DIP48,.6 LDCC68,1.0SQ DIP48,.6 LCC68,.95SQ LCC68,.95SQ FL48,.6 DIP48,.6 DIP48,.6 LCC68,.95SQ LCC68,.95SQ
Package shape RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER CHIP CARRIER FLATPACK IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES YES YES NO NO YES YES
technology TTL TTL TTL TTL TTL TTL TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY MILITARY MILITARY COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND THROUGH-HOLE NO LEAD NO LEAD FLAT THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL QUAD DUAL QUAD QUAD DUAL DUAL DUAL QUAD QUAD
Maker AMD - - AMD AMD AMD AMD AMD AMD AMD
Certification status Not Qualified - - Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified -

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