Microprocessor, CMOS, CBGA1023, 33 X 33 MM, 2.72 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, FC-BGA-1023
Parameter Name | Attribute value |
Maker | e2v technologies |
Parts packaging code | BGA |
package instruction | BGA, |
Contacts | 1023 |
Reach Compliance Code | compliant |
Address bus width | 16 |
bit size | 32 |
boundary scan | YES |
External data bus width | 64 |
Format | FLOATING POINT |
Integrated cache | YES |
JESD-30 code | S-CBGA-B1023 |
JESD-609 code | e1 |
length | 33 mm |
low power mode | YES |
Number of terminals | 1023 |
Maximum operating temperature | 110 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Certification status | Not Qualified |
Maximum seat height | 2.77 mm |
speed | 1333 MHz |
Maximum supply voltage | 1.1 V |
Minimum supply voltage | 1 V |
Nominal supply voltage | 1.05 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
width | 33 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |