EDI3DG328V10D1 datasheet, PDF - EEWORLD Datasheet

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EDI3DG328V10D1: DescriptionSynchronous DRAM Module, 8MX32, CMOS, SODIMM-144; Categorystorage storage; File Size97KB，3 Pages; ManufacturerWhite Microelectronics

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EDI3DG328V10D1 Overview

Synchronous DRAM Module, 8MX32, CMOS, SODIMM-144

EDI3DG328V10D1 Parametric

Parameter Name	Attribute value
Maker	White Microelectronics
package instruction	,
Reach Compliance Code	unknown
access mode	FOUR BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N144
memory density	268435456 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	144
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
organize	8MX32
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified
self refresh	YES
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Terminal form	NO LEAD
Terminal location	DUAL

EDI3DG328V10D1 Preview

EDI3DG328V

8Mx32 Synchronous DRAM SO-DIMM, 3.3V

FEATURES

s

Cycle time of 10ns, 12ns and 15ns

s

Packaging:

• 144 pin SO-DIMM (Package 396)

s

Burst Mode Operation (Sequential & Interleave)

s

Auto & Self Refresh Capability (4096 cycles /64ms)

s

LVTTL compatible inputs and outputs

s

MRS cycle with address key programs

s

Burst Length (1, 2, 4, 8 & Full Page)

s

Data Scramble

s

All inputs are sampled at the positive edge of the system clock

s

Serial Presence Detect with EEPROM

s

Single 3.3 Volts Operation

PIN CONFIGURATION

Pin Symbol Pin Symbol Pin Symbol

1

V

SS

2

V

SS

73

NC

3

DQ

0

4

DQ

32

75

V

SS

5

DQ

1

6

DQ

33

77

NC

7

DQ

2

8

DQ

34

79

NC

9

DQ

3

10

DQ

35

81

V

CC

11

V

CC

12

V

CC

83

NC

13

DQ

4

14

DQ

36

85

NC

15

DQ

5

16

DQ

37

87

NC

17

DQ

6

18

DQ

38

89

NC

19

DQ

7

20

DQ

39

91

V

SS

21

V

SS

22

V

SS

93

NC

23 DQM

0

24 DQM

4

95

NC

25 DQM

1

26 DQM

5

97

NC

27

V

CC

28

V

CC

99

NC

29

A

0

30

A

3

101

V

CC

31

A

1

32

A

4

103

A

6

33

A

2

34

A

5

105

A

8

35

V

SS

36

V

SS

107

V

SS

37

DQ

8

38

DQ

40

109

A

9

39

DQ

9

40

DQ

41

111 A

10

/AP

41 DQ

10

42

DQ

42

113

V

SS

43 DQ

11

44

DQ

43

115

NC

45

V

CC

46

V

CC

117

NC

47 DQ

12

48

DQ

44

119

V

SS

49 DQ

13

50

DQ

45

121

NC

51 DQ

14

52

DQ

46

123

NC

53 DQ

13

54

DQ

45

125

NC

55 DQ

14

56

DQ

46

127

NC

57

NC

58

NC

129

V

CC

59

NC

60

NC

131

NC

61 CLK

0

62 CKE

0

133

NC

63

V

CC

64

V

CC

135

NC

65 RAS\

66 CAS\

137

NC

67

WE\

68

NC

139

V

SS

69

CS

0

\

70 A

12

/NC 141 SDA

71

NC

72

NC

143

V

CC

NOTES:

1. A

12

(Pin 70) is NC when using 4 bank devices

2. BA

1

(Pin 110) is on C when using 2 bank devices

Pin Symbol

74 CLK

1

76

V

SS

78

NC

80

NC

82

V

CC

84

NC

86

NC

88

NC

90

NC

92

V

SS

94

NC

96

NC

98

NC

100

NC

102

V

CC

104

A

7

106

A

9

108

V

SS

110 BA

1

112

A

11

114

V

CC

116

NC

118

NC

120

V

SS

122

NC

124

NC

126

NC

128

NC

130

V

CC

132

NC

134

NC

136

NC

138

NC

140

V

SS

142 SCL

144

V

CC

The EDI3DG328V are organized as 8Megx32 Synchronous high

density DRAM Modules which are based on 4 CMOS 8Megx8bit

DRAMs with 2 or 4 banks in a TSOP package which are mounted

on an FR4 substrate. The module also includes a serial EEPROM

in an 8-pin TSOP package.

The module is a 144 Pin Small Outline Dual In-Line Memory

module with gold contacts.

PIN DESCRIPTION

A

0-12

BA

0-1

DQ

0-15

,

DQ

32-47

CLK-CKL

1

RAS\

CAS\

CKE

0

DQM

0

,

1

,

4

,

5

CS

0

\

WE\

SDA

SCL

V

CC

V

SS

NC

Address lines

Bank Select

Data Input/Output

Clock Input

Row Address Strobe

Column Address Strobe

Clock Enable Input

DQM

Chip Select Input

Write Enable

Serial Data I/O

Serial Clock

Power Supply

Ground

No Connection

NOTE:

DQMs vs Data I/Os

DQM

0

controls DQ

0-7

DQM

1

controls DQ

8-15

DQM

4

controls DQ

32-39

DQM

5

controls DQ

40-47

January 1998 Rev. 0

1

White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com

EDI3DG328V

BLOCK DIAGRAM

BA

0-1

CS

0

\

CKE

0

WE\

RAS\

CAS\

DQ

0-7

DQ

32-39

DQM

0

DQM

4

DQ

8-15

DQ

40-47

DQM

1

CLK

0

10 Ohm

SCL

DQM

5

CLK

1

10 Ohm

SERIAL PD

EEPROM

SDA

White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com

2

EDI3DG328V

PACKAGE DESCRIPTION:

Package No. 396

4.06 (0.160)

MAX.

67.75 (2.667)

67.45 (2.656)

2.00 (0.079) R

(2X)

144 PIN SO-DIMM

1.80 (0.071)

(2X)

28.07 (1.105)

20.00 (0.787) MAX

TYP

6.00 (0.236)

1.50 (0.059)

TYP

2.00 (0.079)

PIN 1

1.10 (0.043)

0.60 (0.024)

TYP

60.60 (2.386)

63.60 (2.504)

0.80 (0.032)

TYP

4.00 (0.157)

0.90 (0.035)

2.22 (0.100)

3.30 (0.83)

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

ORDERING INFORMATION

Part Number

EDI3DG328V8D1

EDI3DG328V10D1

EDI3DG328V12D1

Organization

8M x 32 (4 bank SDRAMS)

8M x 32 (4bank SDRAMS)

8M x 32 (4 bank SDRAMS)

Operating

Frequency

125 Mhz

100 Mhz

83 Mhz

Package No.

396

3

White Electronic Designs Corporation • (508) 366-5151 • www.whiteedc.com

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EDI3DG328V10D1 Related Products

	EDI3DG328V10D1	EDI3DG328V8D1	EDI3DG328V12D1
Description	Synchronous DRAM Module, 8MX32, CMOS, SODIMM-144	Synchronous DRAM Module, 8MX32, CMOS, SODIMM-144	Synchronous DRAM Module, 8MX32, CMOS, SODIMM-144
Maker	White Microelectronics	White Microelectronics	White Microelectronics
Reach Compliance Code	unknown	unknown	unknown
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N144	R-XDMA-N144	R-XDMA-N144
memory density	268435456 bit	268435456 bit	268435456 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	32	32	32
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	144	144	144
word count	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	8MX32	8MX32	8MX32
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Certification status	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL

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