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Datasheet> All Categories > storage> storage> KMM372F3280BK3-6
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KMM372F3280BK3-6

Description
EDO DRAM Module, 32MX72, 60ns, CMOS, DIMM-168
Categorystorage    storage   
File Size480KB，20 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KMM372F3280BK3-6 Overview

EDO DRAM Module, 32MX72, 60ns, CMOS, DIMM-168

KMM372F3280BK3-6 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE WITH EDO
Maximum access time60 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density2415919104 bit
Memory IC TypeEDO DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals168
word count33554432 words
character code32000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX72
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height41.91 mm
Maximum standby current0.03 A
Maximum slew rate2.08 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL

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DRAM MODULE
KMM372F320(8)0BK3
KMM372F320(8)0BK3 EDO Mode
32M x 72 DRAM DIMM with ECC Using 16Mx4, 4K & 8K Refresh, 3.3V
GENERAL DESCRIPTION
The Samsung KMM372F320(8)0B is a 32Mx72bits Dynamic
RAM high density memory module. The Samsung
KMM372F320(8)0B consists of thirty-six CMOS 16Mx4bits
DRAMs in SOJ 400mil packages and two 16 bits driver IC in
TSSOP package mounted on a 168-pin glass-epoxy sub-
strate. A 0.1 or 0.22uF decoupling capacitor is mounted on
the printed circuit board for each DRAM. The
KMM372F320(8)0B is a Dual In-line Memory Module and is
intended for mounting into 168 pin edge connector sockets.
FEATURES
• Part Identification
Part number
KMM372F3200BK3
KMM372F3280BK3
PKG
SOJ
SOJ
Ref.
4K
8K
CBR Ref.
ROR Ref.
4K/64ms
4K/64ms
8K/64ms
• Extended Data Out Mode Operation
• CAS-before-RAS Refresh capability
• RAS-only and Hidden refresh capability
• LVTTL compatible inputs and outputs
• Single 3.3V±0.3V power supply
• JEDEC standard pinout & Buffered PDpin
• Buffered input except RAS and DQ
• PCB : Height(1650mil), double sided component
PERFORMANCE RANGE
Speed
-5
-6
t
RAC
50ns
60ns
t
CAC
18ns
20ns
t
RC
84ns
104ns
t
HPC
20ns
25ns
PIN CONFIGURATIONS
Pin Front Pin Front Pin Front Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
V
SS
DQ0
DQ1
DQ2
DQ3
V
CC
DQ4
DQ5
DQ6
DQ7
DQ8
V
SS
DQ9
DQ10
DQ11
DQ12
DQ13
V
CC
DQ14
DQ15
DQ16
DQ17
V
SS
RSVD
RSVD
V
CC
W0
CAS0
29 *CAS2 57
30 RAS0 58
31 OE0 59
60
32
V
SS
61
33
A0
62
A2
34
63
A4
35
64
A6
36
65
A8
37
66
A10
38
67
A12
39
68
V
CC
40
41 RFU 69
42 RFU 70
71
V
SS
43
44 OE2 72
45 RAS2 73
46 CAS4 74
47 *CAS6 75
76
W2
48
77
V
CC
49
50 RSVD 78
51 RSVD 79
52 DQ18 80
53 DQ19 81
82
V
SS
54
55 DQ20 83
56 DQ21 84
DQ22
DQ23
V
CC
DQ24
RFU
RFU
RFU
RFU
DQ25
DQ26
DQ27
V
SS
DQ28
DQ29
DQ30
DQ31
V
CC
DQ32
DQ33
DQ34
DQ35
V
SS
PD1
PD3
PD5
PD7
ID0
V
CC
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
Back
V
SS
DQ36
DQ37
DQ38
DQ39
V
CC
DQ40
DQ41
DQ42
DQ43
DQ44
V
SS
DQ45
DQ46
DQ47
DQ48
DQ49
V
CC
DQ50
DQ51
DQ52
DQ53
V
SS
RSVD
RSVD
V
CC
RFU
CAS1
Pin
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
Back
*CAS3
RAS1
RFU
V
SS
A1
A3
A5
A7
A9
A11
*A13
V
CC
RFU
B0
V
SS
RFU
RAS3
CAS5
*CAS7
PDE
V
CC
RSVD
RSVD
DQ54
DQ55
V
SS
DQ56
DQ57
Pin Back
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
DQ58
DQ59
V
CC
DQ60
RFU
RFU
RFU
RFU
DQ61
DQ62
DQ63
V
SS
DQ64
DQ65
DQ66
DQ67
V
CC
DQ68
DQ69
DQ70
DQ71
V
SS
PD2
PD4
PD6
PD8
ID1
V
CC
PIN NAMES
Pin Names
A0, B0, A1 - A11
A0, B0, A1 - A12
DQ0 - DQ71
W0, W2
OE0, OE2
RAS0 - RAS3
CAS0, 1,4,5
V
CC
V
SS
NC
PDE
PD1 - 8
ID0 - 1
RSVD
RFU
Function
Address Input(4K ref.)
Address Input(8K ref.)
Data In/Out
Read/Write Enable
Output Enable
Row Address Strobe
Column Address Strobe
Power(+3.3V)
Ground
No Connection
Presence Detect Enable
Presence Detect
ID bit
Reserved Use
Reserved for Future Use
Pins marked
′
*
′
are not used in this module.
PD & ID Table
Pin
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
ID0
ID1
50NS
1
0
0
0
1
0
0
0
0
0
60NS
1
0
0
0
1
1
1
0
0
0
NOTE : A12 is used for only KMM372F3280BK3 (8K Ref.)
PD Note :PD & ID Terminals must each be pulled up through a register to V
CC
at the next higher
level assembly. PDs will be either open (NC) or driven to V
SS
via on-board buffer circuits.
PD : 0 for Vol of Drive IC & 1 for N.C
ID : 0 for Vss & 1 for N.C
ID Note : IDs will be either open (NC) or connected directly to V
SS
without a buffer.

KMM372F3280BK3-6 Related Products

KMM372F3280BK3-6 KMM372F3280BK3-5 KMM372F3200BK3-5 KMM372F3200BK3-6
Description EDO DRAM Module, 32MX72, 60ns, CMOS, DIMM-168 EDO DRAM Module, 32MX72, 50ns, CMOS, DIMM-168 EDO DRAM Module, 32MX72, 50ns, CMOS, DIMM-168 EDO DRAM Module, 32MX72, 60ns, CMOS, DIMM-168
Parts packaging code DIMM DIMM DIMM DIMM
package instruction DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168
Contacts 168 168 168 168
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO FAST PAGE WITH EDO
Maximum access time 60 ns 50 ns 50 ns 60 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 2415919104 bit 2415919104 bit 2415919104 bit 2415919104 bit
Memory IC Type EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE EDO DRAM MODULE
memory width 72 72 72 72
Number of functions 1 1 1 1
Number of ports 1 1 1 1
Number of terminals 168 168 168 168
word count 33554432 words 33554432 words 33554432 words 33554432 words
character code 32000000 32000000 32000000 32000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 32MX72 32MX72 32MX72 32MX72
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 4096 4096
Maximum seat height 41.91 mm 41.91 mm 41.91 mm 41.91 mm
Maximum standby current 0.03 A 0.03 A 0.03 A 0.03 A
Maximum slew rate 2.08 mA 2.26 mA 2.26 mA 2.08 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
Maker SAMSUNG - SAMSUNG SAMSUNG

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Shortcut:   A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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