Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64,
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Cypress Semiconductor |
package instruction | QFP, QFP64,.55SQ |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
bit size | 8 |
CPU series | F2MC-8 |
JESD-30 code | S-PQFP-G64 |
JESD-609 code | e3 |
Number of terminals | 64 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP64,.55SQ |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
RAM (bytes) | 1008 |
rom(word) | 36864 |
ROM programmability | FLASH |
speed | 16.25 MHz |
Maximum slew rate | 39.5 mA |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 0.635 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
MB95F476KPMC2-G-SNE2 | MB95F478HPMC2-G-SNE2 | MB95F474KPMC2-G-SNE2 | MB95F478KPMC1-G-SNE2 | MB95F474HPMC2-G-SNE2 | MB95F476HPMC2-G-SNE2 | MB95F476KPMC1-G-SNE2 | MB95F474KPMC1-G-SNE2 | |
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Description | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, | Microcontroller, 8-Bit, FLASH, F2MC-8 CPU, 16.25MHz, CMOS, PQFP64, |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
package instruction | QFP, QFP64,.55SQ | QFP, QFP64,.55SQ | QFP, QFP64,.55SQ | QFP, QFP64,.47SQ,20 | QFP, QFP64,.55SQ | QFP, QFP64,.55SQ | QFP, QFP64,.47SQ,20 | QFP, QFP64,.47SQ,20 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Maker | Cypress Semiconductor | Cypress Semiconductor | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
bit size | 8 | 8 | - | - | 8 | - | 8 | 8 |
CPU series | F2MC-8 | F2MC-8 | - | - | F2MC-8 | - | F2MC-8 | F2MC-8 |
JESD-30 code | S-PQFP-G64 | S-PQFP-G64 | - | - | S-PQFP-G64 | - | S-PQFP-G64 | S-PQFP-G64 |
JESD-609 code | e3 | e3 | - | - | e3 | - | e3 | e3 |
Number of terminals | 64 | 64 | - | - | 64 | - | 64 | 64 |
Maximum operating temperature | 85 °C | 85 °C | - | - | 85 °C | - | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | - | - | -40 °C | - | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP | - | - | QFP | - | QFP | QFP |
Encapsulate equivalent code | QFP64,.55SQ | QFP64,.55SQ | - | - | QFP64,.55SQ | - | QFP64,.47SQ,20 | QFP64,.47SQ,20 |
Package shape | SQUARE | SQUARE | - | - | SQUARE | - | SQUARE | SQUARE |
Package form | FLATPACK | FLATPACK | - | - | FLATPACK | - | FLATPACK | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | - | - | 5 V | - | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified |
RAM (bytes) | 1008 | 2032 | - | - | 496 | - | 1008 | 496 |
rom(word) | 36864 | 61440 | - | - | 20480 | - | 36864 | 20480 |
ROM programmability | FLASH | FLASH | - | - | FLASH | - | FLASH | FLASH |
speed | 16.25 MHz | 16.25 MHz | - | - | 16.25 MHz | - | 16.25 MHz | 16.25 MHz |
Maximum slew rate | 39.5 mA | 39.5 mA | - | - | 39.5 mA | - | 39.5 mA | 39.5 mA |
Nominal supply voltage | 5 V | 5 V | - | - | 5 V | - | 5 V | 5 V |
surface mount | YES | YES | - | - | YES | - | YES | YES |
technology | CMOS | CMOS | - | - | CMOS | - | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin (Sn) | Tin (Sn) | - | - | Tin (Sn) | - | Tin (Sn) | Tin (Sn) |
Terminal form | GULL WING | GULL WING | - | - | GULL WING | - | GULL WING | GULL WING |
Terminal pitch | 0.635 mm | 0.635 mm | - | - | 0.635 mm | - | 0.5 mm | 0.5 mm |
Terminal location | QUAD | QUAD | - | - | QUAD | - | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | - | - | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER |