Pipeline Register, 8-Bit, CMOS, CQCC28
Parameter Name | Attribute value |
Maker | TRW Inc |
package instruction | , |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Other features | OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 30MHZ |
boundary scan | NO |
maximum clock frequency | 28 MHz |
External data bus width | 8 |
JESD-30 code | S-CQCC-N28 |
low power mode | NO |
Number of terminals | 28 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output data bus width | 8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Certification status | Not Qualified |
Maximum slew rate | 35 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | NO LEAD |
Terminal location | QUAD |
uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, PIPELINE REGISTER |
TMC2011C3V | TMC2011B2V | TMC2011B2C | TMC2111C3V | TMC2111B2C | |
---|---|---|---|---|---|
Description | Pipeline Register, 8-Bit, CMOS, CQCC28 | Shift Register, 18-Bit, CMOS, CDIP24 | Shift Register, 18-Bit, CMOS, CDIP24 | Shift Register, 1-Bit, CMOS, CQCC28 | Shift Register, 1-Bit, CMOS, CDIP24 |
package instruction | , | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown |
JESD-30 code | S-CQCC-N28 | R-XDIP-T24 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 |
Number of terminals | 28 | 24 | 24 | 28 | 24 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C |
Minimum operating temperature | -55 °C | -55 °C | - | -55 °C | - |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | NO | NO | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
Terminal location | QUAD | DUAL | DUAL | QUAD | DUAL |
Maker | TRW Inc | - | - | TRW Inc | TRW Inc |
Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible |
JESD-609 code | - | e0 | e0 | e0 | e0 |
Number of digits | - | 18 | 18 | 1 | 1 |
Number of functions | - | 8 | 8 | 8 | 8 |
encapsulated code | - | DIP | DIP | QCCN | DIP |
Encapsulate equivalent code | - | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 |
power supply | - | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |