2KX8 UVPROM, 150ns, CDIP24, CERAMIC, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
Parts packaging code | DIP |
package instruction | WDIP, DIP24,.6 |
Contacts | 24 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 150 ns |
Other features | TTL COMPATIBLE INPUT & OUTPUT LEVELS |
I/O type | COMMON |
JESD-30 code | R-GDIP-T24 |
JESD-609 code | e0 |
memory density | 16384 bit |
Memory IC Type | UVPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 24 |
word count | 2048 words |
character code | 2000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 2KX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.969 mm |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.02 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
NMC27C16BQE150 | NMC27C16BQE200 | NMC27C16BQ200 | NMC27C16BQ150 | |
---|---|---|---|---|
Description | 2KX8 UVPROM, 150ns, CDIP24, CERAMIC, DIP-24 | 2KX8 UVPROM, 200ns, CDIP24, CERAMIC, DIP-24 | IC 2K X 8 UVPROM, 200 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | IC 2K X 8 UVPROM, 150 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
Parts packaging code | DIP | DIP | DIP | DIP |
package instruction | WDIP, DIP24,.6 | WDIP, DIP24,.6 | WDIP, DIP24,.6 | WDIP, DIP24,.6 |
Contacts | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 150 ns | 200 ns | 200 ns | 150 ns |
Other features | TTL COMPATIBLE INPUT & OUTPUT LEVELS | TTL COMPATIBLE INPUT & OUTPUT LEVELS | TTL COMPATIBLE INPUT & OUTPUT LEVELS | TTL COMPATIBLE INPUT & OUTPUT LEVELS |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 |
memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 | 24 |
word count | 2048 words | 2048 words | 2048 words | 2048 words |
character code | 2000 | 2000 | 2000 | 2000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C |
organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | WDIP | WDIP | WDIP | WDIP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.969 mm | 5.969 mm | 5.969 mm | 5.969 mm |
Maximum standby current | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
Maximum slew rate | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |