M69AR024BL70ZB8T datasheet, PDF

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M69AR024BL70ZB8T: Description1MX16 STANDARD SRAM, 70ns, PBGA48, 6 X 8 MM, 0.75 MM PITCH, TFBGA-48; Categorystorage storage; File Size418KB，32 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M69AR024BL70ZB8T Overview

1MX16 STANDARD SRAM, 70ns, PBGA48, 6 X 8 MM, 0.75 MM PITCH, TFBGA-48

M69AR024BL70ZB8T Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	TFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	8 mm
memory density	16777216 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
organize	1MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/2 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00001 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	2.25 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm

M69AR024BL70ZB8T Related Products

	M69AR024BL70ZB8T	M69AR024BL80ZB8T
Description	1MX16 STANDARD SRAM, 70ns, PBGA48, 6 X 8 MM, 0.75 MM PITCH, TFBGA-48	1MX16 STANDARD SRAM, 80ns, PBGA48, 6 X 8 MM, 0.75 MM PITCH, TFBGA-48
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to
Maker	STMicroelectronics	STMicroelectronics
Parts packaging code	BGA	BGA
package instruction	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30
Contacts	48	48
Reach Compliance Code	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A
Maximum access time	70 ns	80 ns
I/O type	COMMON	COMMON
JESD-30 code	R-PBGA-B48	R-PBGA-B48
JESD-609 code	e1	e1
length	8 mm	8 mm
memory density	16777216 bit	16777216 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	16	16
Number of functions	1	1
Number of terminals	48	48
word count	1048576 words	1048576 words
character code	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-30 °C	-30 °C
organize	1MX16	1MX16
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA
Encapsulate equivalent code	BGA48,6X8,30	BGA48,6X8,30
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8/2 V	1.8/2 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm
Maximum standby current	0.00001 A	0.00001 A
Maximum slew rate	0.02 mA	0.02 mA
Maximum supply voltage (Vsup)	2.25 V	2.25 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	6 mm	6 mm

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