ADC, Dual-Slope, 1 Func, Parallel, Word Access, CMOS, CDIP24
Parameter Name | Attribute value |
Maker | Teledyne Technologies Incorporated |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum analog input voltage | 0.2 V |
Minimum analog input voltage | |
Converter type | ADC, DUAL-SLOPE |
JESD-30 code | R-GDIP-T24 |
Number of analog input channels | 1 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output bit code | BINARY CODED DECIMAL |
Output format | PARALLEL, WORD |
Package body material | CERAMIC, GLASS-SEALED |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Maximum slew rate | 4 mA |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
TC14433AEJG | TC14433EJG | TC14433EPG | TC14433AEPG | |
---|---|---|---|---|
Description | ADC, Dual-Slope, 1 Func, Parallel, Word Access, CMOS, CDIP24 | ADC, Dual-Slope, 1 Func, Parallel, Word Access, CMOS, CDIP24 | ADC, Dual-Slope, 1 Func, Parallel, Word Access, CMOS, PDIP24 | ADC, Dual-Slope, 1 Func, Parallel, Word Access, CMOS, PDIP24 |
Maker | Teledyne Technologies Incorporated | Teledyne Technologies Incorporated | Teledyne Technologies Incorporated | Teledyne Technologies Incorporated |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum analog input voltage | 0.2 V | 0.2 V | 0.2 V | 0.2 V |
Converter type | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE | ADC, DUAL-SLOPE |
JESD-30 code | R-GDIP-T24 | R-GDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 | 24 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Output bit code | BINARY CODED DECIMAL | BINARY CODED DECIMAL | BINARY CODED DECIMAL | BINARY CODED DECIMAL |
Output format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 4 mA | 4 mA | 4 mA | 4 mA |
surface mount | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | DUAL | DUAL | DUAL | DUAL |