|
SI4206-BMR |
SI4206-BM |
Description |
RF and Baseband Circuit, CMOS, 8 X 8 MM, LEAD FREE, LGA-32 |
RF and Baseband Circuit, CMOS, 8 X 8 MM, LEAD FREE, LGA-32 |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Silicon Laboratories Inc |
Silicon Laboratories Inc |
Parts packaging code |
LGA |
LGA |
package instruction |
LFLGA, |
LFLGA, |
Contacts |
32 |
32 |
Reach Compliance Code |
unknown |
unknown |
JESD-30 code |
S-XBGA-B32 |
S-XBGA-B32 |
length |
8 mm |
8 mm |
Number of functions |
1 |
1 |
Number of terminals |
32 |
32 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-20 °C |
-20 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
LFLGA |
LFLGA |
Package shape |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
1.42 mm |
1.42 mm |
Nominal supply voltage |
2.85 V |
2.85 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Telecom integrated circuit types |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
Temperature level |
OTHER |
OTHER |
Terminal form |
BUTT |
BUTT |
Terminal pitch |
0.8 mm |
0.8 mm |
Terminal location |
BOTTOM |
BOTTOM |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
8 mm |
8 mm |