SST32HF324C-70-4C-BFS datasheet, PDF

SST32HF324C-70-4C-BFS: DescriptionMemory Circuit, 2MX16, CMOS, PBGA63, 8 X 10 MM, 1.20 MM HEIGHT, TFBGA-63; Categorystorage storage; File Size432KB，34 Pages; ManufacturerSilicon Laboratories Inc

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SST32HF324C-70-4C-BFS Overview

Memory Circuit, 2MX16, CMOS, PBGA63, 8 X 10 MM, 1.20 MM HEIGHT, TFBGA-63

Parameter Name	Attribute value
Maker	Silicon Laboratories Inc
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	63
Reach Compliance Code	unknown
Other features	SRAM IS ORGANISED AS 256K X 16
JESD-30 code	R-PBGA-B63
length	10 mm
memory density	33554432 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	63
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm

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