EE PLD, 6ns, 32-Cell, CMOS, PBGA49, BGA-49
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Lattice |
Parts packaging code | BGA |
package instruction | BGA-49 |
Contacts | 49 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Other features | YES |
maximum clock frequency | 154 MHz |
In-system programmable | YES |
JESD-30 code | S-PBGA-B49 |
JESD-609 code | e0 |
JTAG BST | NO |
length | 7 mm |
Dedicated input times | |
Number of I/O lines | 32 |
Number of macro cells | 32 |
Number of terminals | 49 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 0 DEDICATED INPUTS, 32 I/O |
Output function | MACROCELL |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA49,7X7,32 |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Programmable logic type | EE PLD |
propagation delay | 6 ns |
Certification status | Not Qualified |
Maximum seat height | 1.5 mm |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7 mm |
ISPLSI2032VE-200LB49 | ISPLSI2032VE-200LJ44 | ISPLSI2032VE-200LT48 | |
---|---|---|---|
Description | EE PLD, 6ns, 32-Cell, CMOS, PBGA49, BGA-49 | EE PLD, 6ns, 32-Cell, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 6ns, CMOS, PQFP48, TQFP-48 |
Is it lead-free? | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | Lattice | Lattice | Lattice |
Parts packaging code | BGA | LCC | QFP |
package instruction | BGA-49 | PLASTIC, LCC-44 | TQFP-48 |
Contacts | 49 | 44 | 48 |
Reach Compliance Code | compliant | unknown | not_compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
maximum clock frequency | 154 MHz | 154 MHz | 154 MHz |
JESD-30 code | S-PBGA-B49 | S-PQCC-J44 | S-PQFP-G48 |
JESD-609 code | e0 | e0 | e0 |
length | 7 mm | 16.5862 mm | 7 mm |
Number of I/O lines | 32 | 32 | 32 |
Number of terminals | 49 | 44 | 48 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O |
Output function | MACROCELL | MACROCELL | MACROCELL |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LFBGA | QCCJ | FQFP |
Package shape | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | CHIP CARRIER | FLATPACK, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 225 | 240 |
Programmable logic type | EE PLD | EE PLD | EE PLD |
propagation delay | 6 ns | 6 ns | 6 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage | 3 V | 3 V | 3 V |
Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | BALL | J BEND | GULL WING |
Terminal pitch | 0.8 mm | 1.27 mm | 0.5 mm |
Terminal location | BOTTOM | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 30 |
width | 7 mm | 16.5862 mm | 7 mm |
Other features | YES | YES | - |
In-system programmable | YES | YES | - |
JTAG BST | NO | NO | - |
Number of macro cells | 32 | 32 | - |
Encapsulate equivalent code | BGA49,7X7,32 | LDCC44,.7SQ | - |
power supply | 3.3 V | 3.3 V | - |
Maximum seat height | 1.5 mm | 4.57 mm | - |