EEPROM, 128KX32, 140ns, Parallel, CMOS, CQFP68, 0.990 X 0.990 INCH, 0.200 INCH HEIGHT, CERAMIC, QFP-68
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Micross |
Parts packaging code | QFP |
package instruction | 0.990 X 0.990 INCH, 0.200 INCH HEIGHT, CERAMIC, QFP-68 |
Contacts | 68 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.2.C |
Maximum access time | 140 ns |
Other features | CONFIGURABLE AS 512K X 8 |
Spare memory width | 16 |
Data polling | YES |
JESD-30 code | R-CQFP-G68 |
JESD-609 code | e0 |
length | 22.352 mm |
memory density | 4194304 bit |
Memory IC Type | EEPROM |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 68 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 128KX32 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QFP |
Encapsulate equivalent code | QFP68,.99SQ,50 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
page size | 128 words |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 5.08 mm |
Maximum standby current | 0.001 A |
Maximum slew rate | 0.25 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | YES |
width | 22.352 mm |
write protect | SOFTWARE |