HPC26064XXX/E30 datasheet, PDF - EEWORLD Datasheet

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HPC26064XXX/E30: DescriptionIC,MICROCONTROLLER,16-BIT,HPC CPU,CMOS,LLCC,68PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，36 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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HPC26064XXX/E30 Overview

IC,MICROCONTROLLER,16-BIT,HPC CPU,CMOS,LLCC,68PIN,CERAMIC

HPC26064XXX/E30 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	QCCN, LCC68,.95SQ
Reach Compliance Code	unknown
bit size	16
CPU series	HPC
JESD-30 code	S-XQCC-N68
JESD-609 code	e0
Number of terminals	68
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC68,.95SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	512
rom(word)	16384
ROM programmability	MROM
speed	15 MHz
Maximum slew rate	65 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD

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