SLA24C32-D-3 datasheet, PDF - EEWORLD Datasheet

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SLA24C32-D-3: DescriptionEEPROM, 4KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8; Categorystorage storage; File Size358KB，26 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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SLA24C32-D-3 Overview

EEPROM, 4KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8

SLA24C32-D-3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Infineon
Parts packaging code	DIP
package instruction	PLASTIC, DIP-8
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.1 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.52 mm
memory density	32768 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	4096 words
character code	4000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	4.37 mm
Serial bus type	I2C
Maximum standby current	0.000001 A
Maximum slew rate	0.003 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	8 ms
write protect	HARDWARE

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Standard EEPROM ICs

SLx 24C32

32 Kbit (4096

8 bit)

Serial CMOS-EEPROM with

C Synchronous 2-Wire Bus

Data Sheet Preliminary 1998-07-27

SLA24C32-D-3 Related Products

	SLA24C32-D-3	SLA24C32-D-3/P	SLA24C32-S-3	SLA24C32-S-3/P
Description	EEPROM, 4KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8	EEPROM, 4KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8	EEPROM, 4KX8, Serial, CMOS, PDSO8, PLASTIC, DSO-8	EEPROM, 4KX8, Serial, CMOS, PDSO8, PLASTIC, DSO-8
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Infineon	Infineon	Infineon	Infineon
Parts packaging code	DIP	DIP	SOIC	SOIC
package instruction	PLASTIC, DIP-8	PLASTIC, DIP-8	PLASTIC, DSO-8	PLASTIC, DSO-8
Contacts	8	8	8	8
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.1 MHz	0.1 MHz	0.1 MHz	0.1 MHz
Data retention time - minimum	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 code	R-PDIP-T8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e0	e0	e0	e0
length	9.52 mm	9.52 mm	5 mm	5 mm
memory density	32768 bit	32768 bit	32768 bit	32768 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	8	8	8	8
word count	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	4KX8	4KX8	4KX8	4KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP
Encapsulate equivalent code	DIP8,.3	DIP8,.3	SOP8,.25	SOP8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/5 V	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.37 mm	4.37 mm	1.73 mm	1.73 mm
Serial bus type	I2C	I2C	I2C	I2C
Maximum standby current	0.000001 A	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	4 mm	4 mm
Maximum write cycle time (tWC)	8 ms	8 ms	8 ms	8 ms
write protect	HARDWARE	HARDWARE/SOFTWARE	HARDWARE	HARDWARE/SOFTWARE

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