RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Atmel (Microchip) |
| Parts packaging code | BGA |
| package instruction | BGA, BGA360,19X19,50 |
| Contacts | 360 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Address bus width | 32 |
| bit size | 32 |
| boundary scan | YES |
| maximum clock frequency | 133 MHz |
| External data bus width | 64 |
| Format | FLOATING POINT |
| Integrated cache | YES |
| JESD-30 code | S-CBGA-B360 |
| JESD-609 code | e0 |
| length | 25 mm |
| low power mode | YES |
| Number of terminals | 360 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA360,19X19,50 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| power supply | 1.8,1.8/2.5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.2 mm |
| speed | 500 MHz |
| Maximum supply voltage | 1.9 V |
| Minimum supply voltage | 1.7 V |
| Nominal supply voltage | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| width | 25 mm |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD