Power Field-Effect Transistor, 5.5A I(D), 400V, 1.2ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AB, HERMETIC SEALED, METAL, TO-220M, 3 PIN
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | TT Electronics plc |
package instruction | FLANGE MOUNT, S-MSFM-P3 |
Reach Compliance Code | compliant |
Shell connection | SOURCE |
Configuration | SINGLE |
Minimum drain-source breakdown voltage | 400 V |
Maximum drain current (ID) | 5.5 A |
Maximum drain-source on-resistance | 1.2 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-257AB |
JESD-30 code | S-MSFM-P3 |
Number of components | 1 |
Number of terminals | 3 |
Operating mode | ENHANCEMENT MODE |
Package body material | METAL |
Package shape | SQUARE |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Certification status | Not Qualified |
surface mount | NO |
Terminal form | PIN/PEG |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Transistor component materials | SILICON |
IRFY330C-JQR-B | IRFY330C-JQR-BR1 | IRFY330C | |
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Description | Power Field-Effect Transistor, 5.5A I(D), 400V, 1.2ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AB, HERMETIC SEALED, METAL, TO-220M, 3 PIN | Power Field-Effect Transistor, 5.5A I(D), 400V, 1.2ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AB, HERMETIC SEALED, METAL, TO-220M, 3 PIN | Power Field-Effect Transistor, 5.5A I(D), 400V, 1.2ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-257AB, HERMETIC SEALED, METAL, TO-220M, 3 PIN |
Is it Rohs certified? | incompatible | conform to | conform to |
Maker | TT Electronics plc | TT Electronics plc | TT Electronics plc |
package instruction | FLANGE MOUNT, S-MSFM-P3 | FLANGE MOUNT, S-MSFM-P3 | FLANGE MOUNT, S-MSFM-P3 |
Reach Compliance Code | compliant | compliant | compliant |
Shell connection | SOURCE | SOURCE | SOURCE |
Configuration | SINGLE | SINGLE | SINGLE |
Minimum drain-source breakdown voltage | 400 V | 400 V | 400 V |
Maximum drain current (ID) | 5.5 A | 5.5 A | 5.5 A |
Maximum drain-source on-resistance | 1.2 Ω | 1.2 Ω | 1.2 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-257AB | TO-257AB | TO-257AB |
JESD-30 code | S-MSFM-P3 | S-MSFM-P3 | S-MSFM-P3 |
Number of components | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 |
Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
Package body material | METAL | METAL | METAL |
Package shape | SQUARE | SQUARE | SQUARE |
Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal location | SINGLE | SINGLE | SINGLE |
Transistor component materials | SILICON | SILICON | SILICON |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - |