Power Bipolar Transistor, 15A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin, TO-3, 2 PIN
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Objectid | 1927730232 |
Parts packaging code | TO-204AA |
package instruction | TO-3, 2 PIN |
Contacts | 2 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Shell connection | COLLECTOR |
Maximum collector current (IC) | 15 A |
Collector-emitter maximum voltage | 400 V |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 8 |
JEDEC-95 code | TO-3 |
JESD-30 code | O-MBFM-P2 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 2 |
Package body material | METAL |
Package shape | ROUND |
Package form | FLANGE MOUNT |
Polarity/channel type | NPN |
Certification status | Not Qualified |
Guideline | MIL-19500/337 |
surface mount | NO |
Terminal surface | TIN LEAD |
Terminal form | PIN/PEG |
Terminal location | BOTTOM |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
JAN2N6675 | JAN2N6690 | AXUV20ELCS | JAN2N6689 | |
---|---|---|---|---|
Description | Power Bipolar Transistor, 15A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-3, Metal, 2 Pin, TO-3, 2 PIN | Power Bipolar Transistor, 15A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-61, Metal, 3 Pin, TO-61, 3 PIN | Ceramic socket for devices to eliminate soldering to leads | Power Bipolar Transistor, 15A I(C), 300V V(BR)CEO, 1-Element, NPN, Silicon, TO-61, Metal, 3 Pin, TO-61, 3 PIN |
Is it lead-free? | Contains lead | Contains lead | - | Contains lead |
Is it Rohs certified? | incompatible | incompatible | - | incompatible |
Parts packaging code | TO-204AA | TO-61 | - | TO-61 |
package instruction | TO-3, 2 PIN | POST/STUD MOUNT, O-MUPM-X3 | - | POST/STUD MOUNT, O-MUPM-X3 |
Contacts | 2 | 3 | - | 3 |
Reach Compliance Code | unknown | compli | - | compli |
Maximum collector current (IC) | 15 A | 15 A | - | 15 A |
Collector-emitter maximum voltage | 400 V | 400 V | - | 300 V |
Configuration | SINGLE | SINGLE | - | SINGLE |
Minimum DC current gain (hFE) | 8 | 8 | - | 8 |
JEDEC-95 code | TO-3 | TO-61 | - | TO-61 |
JESD-30 code | O-MBFM-P2 | O-MUPM-X3 | - | O-MUPM-X3 |
JESD-609 code | e0 | e0 | - | e0 |
Number of components | 1 | 1 | - | 1 |
Number of terminals | 2 | 3 | - | 3 |
Package body material | METAL | METAL | - | METAL |
Package shape | ROUND | ROUND | - | ROUND |
Package form | FLANGE MOUNT | POST/STUD MOUNT | - | POST/STUD MOUNT |
Polarity/channel type | NPN | NPN | - | NPN |
Certification status | Not Qualified | Qualified | - | Qualified |
Guideline | MIL-19500/337 | MIL-19500/337 | - | MIL-19500/337 |
surface mount | NO | NO | - | NO |
Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG | UNSPECIFIED | - | UNSPECIFIED |
Terminal location | BOTTOM | UPPER | - | UPPER |
transistor applications | SWITCHING | SWITCHING | - | SWITCHING |
Transistor component materials | SILICON | SILICON | - | SILICON |